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Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

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Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

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Martinez, JA.; Belenguer, A.; Esteban González, H. (2019). Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices. IEEE Transactions on Components, Packaging and Manufacturing Technology (Online). 9(11):2276-2281. https://doi.org/10.1109/TCPMT.2019.2915688

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/157288

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Title: Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices
Author: Martinez, Juan A. Belenguer, Angel Esteban González, Héctor
UPV Unit: Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Issued date:
Abstract:
[EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the ...[+]
Subjects: Soldering , Tin , Prototypes , Reliability , Substrates , Contacts , Electromagnetic waveguides , Empty substrate integrated waveguide (ESIW) , Fabrication , Multilayer
Copyrigths: Reserva de todos los derechos
Source:
IEEE Transactions on Components, Packaging and Manufacturing Technology (Online). (eissn: 2156-3985 )
DOI: 10.1109/TCPMT.2019.2915688
Publisher:
Institute of Electrical and Electronics Engineers
Publisher version: https://doi.org/10.1109/TCPMT.2019.2915688
Project ID:
MINECO/TEC2016-75934-C4-3-R
AGENCIA ESTATAL DE INVESTIGACION/TEC2016-75934-C4-1-R
Thanks:
This work was supported by the Ministerio de Economiy Competitividad, Spanish Government, under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R.
Type: Artículo

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