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Compact Folded Bandpass Filter in Empty Substrate Integrated Coaxial Line at S-Band

Martinez, Leticia; Belenguer, Angel; Boria Esbert, Vicente Enrique; Borja, Alejandro L. (Institute of Electrical and Electronics Engineers, 2019-05)

[EN] This letter presents a novel compact folded bandpass filter in empty substrate integrated coaxial line (ESICL) technology. To obtain these compact filters, the inverters are modified to provide a 180 degrees bend when ...
Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

Martinez, Juan A.; Belenguer, Angel; Esteban González, Héctor (Institute of Electrical and Electronics Engineers, 2019-11)

[EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the ...
Through-Wire Microstrip-to-Empty-Substrate-Integrated-Waveguide Transition at Ka-Band

Ballesteros, José A.; Belenguer, Angel; Fernández, Marcos D.; Esteban González, Héctor; Boria Esbert, Vicente Enrique (MDPI AG, 2023-09)

[EN] The advantages of the Substrate-Integrated Waveguide (SIW) in terms of low profile, integration with Printed Circuit Board (PCB) and low cost are maintained by the Empty Substrate-Integrated Waveguide (ESIW). Moreover, ...

Mostrando ítems 1-3 de 3