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Listar por palabra clave "Hybrid integrated-circuit packaging"

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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

Zimmermann, Lars; Preve, Giovan Battista; Tekin, Tolga; Rosin, T.; Landles, K. (Institute of Electrical and Electronics Engineers (IEEE), 2011-05)

[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples ...

Mostrando ítems 1-1 de 1