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Listar por palabra clave "Photonic integration"

RiuNet: Repositorio Institucional de la Universidad Politécnica de Valencia

Listar por palabra clave "Photonic integration"

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    All-Optical Hybrid VO2/Si Waveguide Absorption Switch at Telecommunication Wavelengths 
    Parra Gómez, Jorge; Ivanova-Angelova, Todora; Menghini, Mariela; Homm, Pía; Locquet, Jean-Pierre; Sanchis Kilders, Pablo (Institute of Electrical and Electronics Engineers, 2021-05-01)
    [EN] Vanadium dioxide (VO2) is one of the most promising materials for developing hybrid photonic integrated circuits (PICs). At telecommunication wavelengths, VO2 exhibits a large change on the refractive index (¿n ~ 1 ...
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    Foundry Developments Toward Silicon Nitride Photonics From Visible to the Mid-Infrared 
    Muñoz, Pascual; van Dijk, Paulus W. L.; Geuzebroek, Douwe; Geiselmann, Michael; Domínguez, Carlos; Stassen, Andim; Doménech, José David; Zervas, Michael; Leinse, Arne; Roeloffzen, Chris G.H.; Gargallo, Bernardo; Baños, Rocio; Fernández, Juan; Mico-Cabanes, Gloria; Bru-Orgiles, Luis Alberto; Pastor Abellán, Daniel (Institute of Electrical and Electronics Engineers, 2019-09)
    [EN] Photonic integration technologies have spread in the past decade by means of foundry models that mirror the electronic-integrated circuit industry developments of the past century. Several monolithic technologies ...
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    Microoptomechanical silicon nitride photonic inclinometer 
    Fernández Gámez, Arturo (Universitat Politècnica de València, 2022-10-04)
    [ES] Siguiendo los pasos de la microelectrónica, la fotónica integrada está empezando a incluir sistemas micro-opto-electro-mecánicos (MOEM) para la creación de dispositivos sintonizables o programables y sensores. La ...
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    Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform 
    Zimmermann, Lars; Preve, Giovan Battista; Tekin, Tolga; Rosin, T.; Landles, K. (Institute of Electrical and Electronics Engineers (IEEE), 2011-05)
    [EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples ...
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    Solución de encapsulado para chips fotónicos sobre silicio con múltiples conexiones ópticas y eléctricas 
    Llopis Ferrer, Mercé (Universitat Politècnica de València, 2013-02-22)
    [ES] El objetivo de este trabajo es demostrar experimentalmente una solución de encapsulado con múltiples puertos que integre tecnología fotónica y electrónica, usando acoplo vertical mediante grating couplers y fiber ...