Säily, Mikko; Barjau, Carlos; Navrátil, David; Prasad, Athul; Gomez-Barquero, David; Tesema, Fasil B.(Institute of Electrical and Electronics Engineers, 2019-12)
[EN] The first release of 5th Generation (5G) technology from 3rd Generation Project Partnership (3GPP) Rel'15 has been completed in December 2018. An open issue with this release of standards is that it only supports ...
Ebrahimi, Masoumeh; Daneshtalab, Masoud; Liljeberg, Pasi; Plosila, Juha; Flich Cardo, José; Tenhunen, Hannu(Institute of Electrical and Electronics Engineers (IEEE), 2014-03)
Combining the benefits of 3D ICs and Networks-on-Chip (NoCs) schemes provides a significant performance gain in Chip Multiprocessors (CMPs) architectures. As multicast communication is commonly used in cache coherence ...