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Corrosión bajo tensión en la soldadura de acero inoxidable en ambientes corrosivos

Montesinos Gasent, Sergio (Universitat Politècnica de València, 2020-10-19)

[ES] El objetivo que se pretenden alcanzar en este proyecto, es el análisis del comportamiento de los aceros inoxidables a nivel corrosivo, en función de distintos estados tensiónales y más concretamente, los relacionados ...
Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

Martinez, Juan A.; Belenguer, Angel; Esteban González, Héctor (Institute of Electrical and Electronics Engineers, 2019-11)

[EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the ...
Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Silvestre, Rocío; Llinares Llopis, Raúl; Contat-Rodrigo, L; Serrano Martínez, Víctor; Ferri, Josué; Garcia-Breijo, Eduardo (MDPI AG, 2022-08)

[EN] The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related ...

Mostrando ítems 1-3 de 3