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Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications

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BrimontZuritaDuarte - Optical fiber-to-chip assembly process for ultra-low loss photonic devices ....pdfVersión editorial (537.27 KB)

Fecha

2020-06-24

Autores

Brimont, Antoine Christian Jacques
Duarte, V. C.
Chmielak, B.
Suckow, S.
Giesecke, A.
PIQUERAS RUIPÉREZ, MIGUEL ÁNGEL

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Handle

https://riunet.upv.es/handle/10251/178658

Cita bibliográfica

Brimont, ACJ.; Zurita Herranz, D.; Duarte, VC.; Mengual, T.; Chmielak, B.; Suckow, S.; Giesecke, A.... (2020). Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications. 1-3. https://riunet.upv.es/handle/10251/178658

Titulación

Resumen

[EN] In this work, we demonstrate an efficient fiber array-to-chip assembly process with a high number of input/output ports. The proposed approach is based on using a pre-alignment coupling structure to separately align the input and output ports. The assembling process has been experimentally validated in photonic integrated circuits fabricated with an ultra-low-loss waveguide technology based on silicon nitride, which features propagation losses as low as 9.5 dB/m. The developed technology is expected to extend the use of integrated photonics for space applications

Palabras clave

Silicon nitride, Fiber-to-chip coupling, Assembling, Packaging.

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Enlaces relacionados

https://www.ecio-conference.org/2020-proceedings/

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