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Average power handling capability of microstrip passive circuits considering metal housing and environment conditions

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Average power handling capability of microstrip passive circuits considering metal housing and environment conditions

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dc.contributor.author Sánchez-Soriano, Miguel Ángel es_ES
dc.contributor.author Quere, Yves es_ES
dc.contributor.author Le-Saux, Vincent es_ES
dc.contributor.author Quendo, Cedric es_ES
dc.contributor.author Cadiou, Stephan es_ES
dc.date.accessioned 2018-09-17T06:48:34Z
dc.date.available 2018-09-17T06:48:34Z
dc.date.issued 2014 es_ES
dc.identifier.issn 1070-9886 es_ES
dc.identifier.uri http://hdl.handle.net/10251/107314
dc.description.abstract [EN] In this paper, the average power handling capability (APHC) of microstrip passive circuits considering the metal housing and environment conditions is investigated in detail. A systematic method is proposed for the computation of the APHC of microstrip circuits in open and enclosed metal housing configurations, typically used in microwave components. The method also yields an estimate of the maximum temperature in a microstrip circuit for a given input power. Closed-form equations accounting for external conditions, such as convection or radiation heat transfer are given to evaluate the APHC. For validation, two microstrip bandstop filters centered at 10 GHz are analyzed following the proposed model, and the results are compared with those simulated showing a good agreement. In addition, both circuits are fabricated and characterized. Thermal profile measurements are provided, confirming the predicted results. The effect of the topology layout and the electromagnetic performance on the APHC are also discussed. es_ES
dc.description.sponsorship This work was supported by the Euripides European Project MIDIMU-HD. Recommended for publication by Associate Editor A. Shapiro upon evaluation of reviewers' comments.
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers es_ES
dc.relation.ispartof IEEE Transactions on Components Packaging and Manufacturing Technology Part A es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Average power handling capability (APHC) es_ES
dc.subject Electrothermal analysis es_ES
dc.subject Metal housing es_ES
dc.subject Microwave devices es_ES
dc.subject Planar circuits es_ES
dc.subject Power applications es_ES
dc.title Average power handling capability of microstrip passive circuits considering metal housing and environment conditions es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/TCPMT.2014.2345100 es_ES
dc.relation.projectID info:eu-repo/grantAgreement/EC/FP7/201380/EU/EUropean Research initiative to develop Imaging Probes for early In-vivo Diagnosis and Evaluation of response to therapeutic Substances/
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia es_ES
dc.description.bibliographicCitation Sánchez-Soriano, MÁ.; Quere, Y.; Le-Saux, V.; Quendo, C.; Cadiou, S. (2014). Average power handling capability of microstrip passive circuits considering metal housing and environment conditions. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 4(10):1624-1633. https://doi.org/10.1109/TCPMT.2014.2345100 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://doi.org/10.1109/TCPMT.2014.2345100 es_ES
dc.description.upvformatpinicio 1624 es_ES
dc.description.upvformatpfin 1633 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 4 es_ES
dc.description.issue 10 es_ES
dc.relation.pasarela S\285096 es_ES
dc.contributor.funder European Commission es_ES


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