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Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band

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Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band

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Martínez-Zamora, JÁ.; De Dios, JJ.; Belenguer Martínez, Á.; Esteban González, H.; Boria Esbert, VE. (2018). Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band. IEEE Microwave and Wireless Components Letters. 28(6):503-505. https://doi.org/10.1109/LMWC.2018.2833214

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/121374

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Title: Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band
Author: Martínez-Zamora, Juan Ángel de Dios, Juan J. Belenguer Martínez, Ángel Esteban González, Héctor Boria Esbert, Vicente Enrique
UPV Unit: Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Issued date:
Abstract:
[EN] Recently, new methodologies for manufacturing empty waveguides completely integrated in a planar substrate have been proposed in order to improve the performance of substrate-integrated devices. One of these alternatives ...[+]
Subjects: Quality factor , Empty Substrate Integrated Waveguide (ESIW) , Substrate Integrated Waveguide (SIW) , Rect- angular waveguide , Microstrip transition.
Copyrigths: Reserva de todos los derechos
Source:
IEEE Microwave and Wireless Components Letters. (issn: 1531-1309 )
DOI: 10.1109/LMWC.2018.2833214
Publisher:
Institute of Electrical and Electronics Engineers
Publisher version: http://doi.org/10.1109/LMWC.2018.2833214
Description: © 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Thanks:
This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R.
Type: Artículo

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