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Versatile Transition for Multilayer Compact Devices in Empty Substrate Integrated Waveguide

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Versatile Transition for Multilayer Compact Devices in Empty Substrate Integrated Waveguide

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dc.contributor.author Ballesteros, José A. es_ES
dc.contributor.author Fernández-Berlanga, Marcos D es_ES
dc.contributor.author Belenguer Martínez, Ángel es_ES
dc.contributor.author Esteban González, Héctor es_ES
dc.contributor.author Boria Esbert, Vicente Enrique es_ES
dc.date.accessioned 2019-05-31T20:45:11Z
dc.date.available 2019-05-31T20:45:11Z
dc.date.issued 2018 es_ES
dc.identifier.issn 1531-1309 es_ES
dc.identifier.uri http://hdl.handle.net/10251/121385
dc.description © 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
dc.description.abstract [EN] Empty substrate integrated waveguide (ESIW) devices can provide high quality and completely integrated devices, but they are usually larger than the same ones imple- mented with alternative technologies. One of the most extended strategies to compact electronic devices is the use of multilayer technology. Nevertheless, to perform multilayer devices in ESIW, a versatile and efficient transition between the guides in different layers is needed. Currently, only one multilayer device is known in this ESIW technology, which is a transition between a pair of guides built in contiguous layers that requires complex and nonstandard 3-D manufacturing processes. In this letter, a multilayer transition to connect a pair of guides separated by an arbitrary number of layers is successfully designed and experimentally validated without 3-D manufacturing processes. This novel and versatile transition opens the way to further develop multilayer compact devices in the ESIW technology such as compact filters. es_ES
dc.description.sponsorship This work was supported by the Ministerio de Economia y Competitividad through Spanish Government under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R. (Corresponding author: Angel Belenguer.) es_ES
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers es_ES
dc.relation.ispartof IEEE Microwave and Wireless Components Letters es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Empty substrate integrated waveguide (ESIW) es_ES
dc.subject Multilayer es_ES
dc.subject Transition es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title Versatile Transition for Multilayer Compact Devices in Empty Substrate Integrated Waveguide es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/LMWC.2018.2825653 es_ES
dc.relation.projectID info:eu-repo/grantAgreement/MINECO//TEC2016-75934-C4-1-R/ES/DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALES/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Ballesteros, JA.; Fernández-Berlanga, MD.; Belenguer Martínez, Á.; Esteban González, H.; Boria Esbert, VE. (2018). Versatile Transition for Multilayer Compact Devices in Empty Substrate Integrated Waveguide. IEEE Microwave and Wireless Components Letters. 28(6):482-484. https://doi.org/10.1109/LMWC.2018.2825653 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://doi.org/10.1109/LMWC.2018.2825653 es_ES
dc.description.upvformatpinicio 482 es_ES
dc.description.upvformatpfin 484 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 28 es_ES
dc.description.issue 6 es_ES
dc.relation.pasarela S\362724 es_ES
dc.contributor.funder Ministerio de Economía y Competitividad es_ES


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