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dc.contributor.author | Quiles, Ferran | es_ES |
dc.contributor.author | Belenguer Martínez, Ángel | es_ES |
dc.contributor.author | Martínez-Zamora, Juan Ángel | es_ES |
dc.contributor.author | Nova-Giménez, Vicente | es_ES |
dc.contributor.author | Esteban González, Héctor | es_ES |
dc.contributor.author | Boria Esbert, Vicente Enrique | es_ES |
dc.date.accessioned | 2019-07-07T20:02:06Z | |
dc.date.available | 2019-07-07T20:02:06Z | |
dc.date.issued | 2018 | es_ES |
dc.identifier.issn | 1531-1309 | es_ES |
dc.identifier.uri | http://hdl.handle.net/10251/123280 | |
dc.description.abstract | [EN] Substrate integrated waveguides are increasingly being used due to their capability of combining the advantages of planar circuits and traditional waveguides. The development of empty substrate integrated waveguides has substantially reduced the related insertion losses, since waves propagate through air instead of propagating through a lossy dielectric medium. Recently, a new empty coaxial structure, completely built with printed circuit boards and integrated in a substrate, has been proposed. It has been named empty substrate integrated coaxial Line (ESICL). The resulting coaxial line has low cost, easy manufacturing, low radiation, low losses, high-quality factor, and is non dispersive. A transition from grounded coplanar waveguide to ESICL already exists. In this work, a transition from microstrip to ESICL is presented for the first time. In order to demonstrate its feasibility, a back-to-back structure and a bandpass filter have been manufactured and measured. | es_ES |
dc.description.sponsorship | This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Research Project TEC2016-75934-C4-3-R and Research Project TEC2016-75934-C4-1-R. | es_ES |
dc.language | Inglés | es_ES |
dc.publisher | Institute of Electrical and Electronics Engineers | es_ES |
dc.relation.ispartof | IEEE Microwave and Wireless Components Letters | es_ES |
dc.rights | Reserva de todos los derechos | es_ES |
dc.subject | Bandpass filter | es_ES |
dc.subject | Empty substrate integrated coaxial line (ESICL) | es_ES |
dc.subject | Empty substrate integrated waveguide (SIW) | es_ES |
dc.subject | SIW | es_ES |
dc.subject | Transition | es_ES |
dc.subject.classification | TEORIA DE LA SEÑAL Y COMUNICACIONES | es_ES |
dc.title | Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition | es_ES |
dc.type | Artículo | es_ES |
dc.identifier.doi | 10.1109/LMWC.2018.2874280 | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/MINECO//TEC2016-75934-C4-1-R/ES/DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALES/ | es_ES |
dc.rights.accessRights | Abierto | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions | es_ES |
dc.description.bibliographicCitation | Quiles, F.; Belenguer Martínez, Á.; Martínez-Zamora, JÁ.; Nova-Giménez, V.; Esteban González, H.; Boria Esbert, VE. (2018). Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition. IEEE Microwave and Wireless Components Letters. 28(12):1080-1082. https://doi.org/10.1109/LMWC.2018.2874280 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | http://doi.org/10.1109/LMWC.2018.2874280 | es_ES |
dc.description.upvformatpinicio | 1080 | es_ES |
dc.description.upvformatpfin | 1082 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 28 | es_ES |
dc.description.issue | 12 | es_ES |
dc.relation.pasarela | S\371319 | es_ES |
dc.contributor.funder | Ministerio de Economía y Competitividad | es_ES |