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Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition

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Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition

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dc.contributor.author Quiles, Ferran es_ES
dc.contributor.author Belenguer Martínez, Ángel es_ES
dc.contributor.author Martínez-Zamora, Juan Ángel es_ES
dc.contributor.author Nova-Giménez, Vicente es_ES
dc.contributor.author Esteban González, Héctor es_ES
dc.contributor.author Boria Esbert, Vicente Enrique es_ES
dc.date.accessioned 2019-07-07T20:02:06Z
dc.date.available 2019-07-07T20:02:06Z
dc.date.issued 2018 es_ES
dc.identifier.issn 1531-1309 es_ES
dc.identifier.uri http://hdl.handle.net/10251/123280
dc.description.abstract [EN] Substrate integrated waveguides are increasingly being used due to their capability of combining the advantages of planar circuits and traditional waveguides. The development of empty substrate integrated waveguides has substantially reduced the related insertion losses, since waves propagate through air instead of propagating through a lossy dielectric medium. Recently, a new empty coaxial structure, completely built with printed circuit boards and integrated in a substrate, has been proposed. It has been named empty substrate integrated coaxial Line (ESICL). The resulting coaxial line has low cost, easy manufacturing, low radiation, low losses, high-quality factor, and is non dispersive. A transition from grounded coplanar waveguide to ESICL already exists. In this work, a transition from microstrip to ESICL is presented for the first time. In order to demonstrate its feasibility, a back-to-back structure and a bandpass filter have been manufactured and measured. es_ES
dc.description.sponsorship This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Research Project TEC2016-75934-C4-3-R and Research Project TEC2016-75934-C4-1-R. es_ES
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers es_ES
dc.relation AEI/TEC2016-75934-C4-1-R es_ES
dc.relation.ispartof IEEE Microwave and Wireless Components Letters es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Bandpass filter es_ES
dc.subject Empty substrate integrated coaxial line (ESICL) es_ES
dc.subject Empty substrate integrated waveguide (SIW) es_ES
dc.subject SIW es_ES
dc.subject Transition es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/LMWC.2018.2874280 es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Quiles, F.; Belenguer Martínez, Á.; Martínez-Zamora, JÁ.; Nova-Giménez, V.; Esteban González, H.; Boria Esbert, VE. (2018). Compact Microstrip to Empty Substrate Integrated Coaxial Line Transition. IEEE Microwave and Wireless Components Letters. 28(12):1080-1082. https://doi.org/10.1109/LMWC.2018.2874280 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://doi.org/10.1109/LMWC.2018.2874280 es_ES
dc.description.upvformatpinicio 1080 es_ES
dc.description.upvformatpfin 1082 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 28 es_ES
dc.description.issue 12 es_ES
dc.relation.pasarela S\371319 es_ES
dc.contributor.funder Agencia Estatal de Investigación es_ES


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