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dc.contributor.author | Scarazzato, T. | es_ES |
dc.contributor.author | Panossian, Z. | es_ES |
dc.contributor.author | García Gabaldón, Montserrat | es_ES |
dc.contributor.author | Ortega Navarro, Emma María | es_ES |
dc.contributor.author | Tenório, J.A.S. | es_ES |
dc.contributor.author | Pérez-Herranz, Valentín | es_ES |
dc.contributor.author | Espinosa, D.C.R. | es_ES |
dc.date.accessioned | 2020-07-22T03:31:54Z | |
dc.date.available | 2020-07-22T03:31:54Z | |
dc.date.issued | 2017-08-01 | es_ES |
dc.identifier.issn | 0376-7388 | es_ES |
dc.identifier.uri | http://hdl.handle.net/10251/148464 | |
dc.description.abstract | [EN] The transport properties of copper chelates across an anion-exchange membrane were investigated by means of chronopotentiometry. Several solutions containing etidronic acid, copper sulfate and potassium chloride were evaluated. Tests were accomplished in a three-compartment reactor using a heterogeneous membrane containing quaternary ammonium functional groups. Results showed a strong relation between the amount of chelated anions and the limiting current density, the electrical resistance and the concentration polarization. An increase in the anionic equivalent charge of the solutions modified the three regions of the current-voltage curves. The acid medium was found to be less favorable because of the possibility of the formation of non-charged species in overlimiting regions. The presence of chloride anions increased the limiting current density, especially when the chloride concentration exceeded the etidronic acid concentration. | es_ES |
dc.description.sponsorship | Authors would like to thank the Institute for Technological Research (IPT), the Institute for Technological Research Foundation (FIPT), to the São Paulo Research Foundation (Fapesp - processes 2012/51871-9, 2014/21943-3 and 2014/13351-9) and the National Council for Scientific and Technological Development. | es_ES |
dc.language | Inglés | es_ES |
dc.publisher | Elsevier | es_ES |
dc.relation.ispartof | Journal of Membrane Science | es_ES |
dc.rights | Reconocimiento - No comercial - Sin obra derivada (by-nc-nd) | es_ES |
dc.subject | Copper chelates | es_ES |
dc.subject | Etidronic acid | es_ES |
dc.subject | Anion-exchange membrane | es_ES |
dc.subject | Chronopotentiometry | es_ES |
dc.subject | Current-voltage curve | es_ES |
dc.subject.classification | INGENIERIA QUIMICA | es_ES |
dc.title | Evaluation of the transport properties of copper ions through a heterogeneous ion-exchange membrane in etidronic acid solutions by chronopotentiometry | es_ES |
dc.type | Artículo | es_ES |
dc.identifier.doi | 10.1016/j.memsci.2017.04.048 | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/FAPESP//2012%2F51871-9/ | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/FAPESP//2014%2F21943-3/ | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/FAPESP//2014%2F13351-9/ | es_ES |
dc.rights.accessRights | Abierto | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Departamento de Ingeniería Química y Nuclear - Departament d'Enginyeria Química i Nuclear | es_ES |
dc.description.bibliographicCitation | Scarazzato, T.; Panossian, Z.; García Gabaldón, M.; Ortega Navarro, EM.; Tenório, J.; Pérez-Herranz, V.; Espinosa, D. (2017). Evaluation of the transport properties of copper ions through a heterogeneous ion-exchange membrane in etidronic acid solutions by chronopotentiometry. Journal of Membrane Science. 535:268-278. https://doi.org/10.1016/j.memsci.2017.04.048 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | https://doi.org/10.1016/j.memsci.2017.04.048 | es_ES |
dc.description.upvformatpinicio | 268 | es_ES |
dc.description.upvformatpfin | 278 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 535 | es_ES |
dc.relation.pasarela | S\336530 | es_ES |
dc.contributor.funder | Fundação de Amparo à Pesquisa do Estado de São Paulo | es_ES |
dc.contributor.funder | Conselho Nacional de Desenvolvimento Científico e Tecnológico, Brasil | es_ES |