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Compact Folded Bandpass Filter in Empty Substrate Integrated Coaxial Line at S-Band

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Compact Folded Bandpass Filter in Empty Substrate Integrated Coaxial Line at S-Band

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Martinez, L.; Belenguer, A.; Boria Esbert, VE.; Borja, AL. (2019). Compact Folded Bandpass Filter in Empty Substrate Integrated Coaxial Line at S-Band. IEEE Microwave and Wireless Components Letters. 29(5):315-317. https://doi.org/10.1109/LMWC.2019.2909178

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/157198

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Title: Compact Folded Bandpass Filter in Empty Substrate Integrated Coaxial Line at S-Band
Author: Martinez, Leticia Belenguer, Angel Boria Esbert, Vicente Enrique Borja, Alejandro L.
UPV Unit: Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Issued date:
Abstract:
[EN] This letter presents a novel compact folded bandpass filter in empty substrate integrated coaxial line (ESICL) technology. To obtain these compact filters, the inverters are modified to provide a 180 degrees bend when ...[+]
Subjects: Bandpass filter , Empty substrate integrated coaxial line (ESICL) , Folded filter
Copyrigths: Reserva de todos los derechos
Source:
IEEE Microwave and Wireless Components Letters. (issn: 1531-1309 )
DOI: 10.1109/LMWC.2019.2909178
Publisher:
Institute of Electrical and Electronics Engineers
Publisher version: https://doi.org/10.1109/LMWC.2019.2909178
Project ID:
MINECO/TEC2016-75934-C4-3-R
AGENCIA ESTATAL DE INVESTIGACION/TEC2016-75934-C4-1-R
Description: © 2019 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Thanks:
This work was supported in part by the Ministerio de Economia y Competitividad, Spanish Government through Research Projects under Grant TEC2016-75934-C4-3-R and Grant TEC2016-75934-C4-1-R and in part by the Ministerio de ...[+]
Type: Artículo

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