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Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

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Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices

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dc.contributor.author Martinez, Juan A. es_ES
dc.contributor.author Belenguer, Angel es_ES
dc.contributor.author Esteban González, Héctor es_ES
dc.date.accessioned 2020-12-17T04:33:11Z
dc.date.available 2020-12-17T04:33:11Z
dc.date.issued 2019-11 es_ES
dc.identifier.uri http://hdl.handle.net/10251/157288
dc.description.abstract [EN] In this paper, a novel mymargin soldering technique that improves the fabrication process of empty substrate integrated waveguide (ESIW) devices is presented. Up until now, in order to fabricate an ESIW device, the tin solder paste was distributed, before assembling, on the contact surface between layers, in order to ensure a good electrical contact. This process has a low degree of repeatability (random soldering thickness and distribution of tin) and reliability (a significant number of nonworking prototypes due to tin overflow). In this paper, we propose the mechanization of a set of plated vias just next to the metalized walls of the ESIW in the central layer. Next, in the top and bottom covers that close this ESIW, additional plated vias are drilled in the same position so that, when the device is assembled (using screws or rivets), metalized holes can be seen passing through the whole structure from top to bottom. These holes are then used as soldering vias that can guide the tin paste straight to the point where it is needed. When the paste is dried, soldered vias ensure a very good electrical contact between layers. In addition, the fluid tin fills any small gap that appears between layers, thus providing a very good electrical contact and mechanical union. This novel soldering technique has been validated with experimental results. Several prototypes of filters centered at 13 and 35 GHz have been fabricated, proving the repeatability and reliability of the proposed soldering technique. es_ES
dc.description.sponsorship This work was supported by the Ministerio de Economiy Competitividad, Spanish Government, under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R. es_ES
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers es_ES
dc.relation MINECO/TEC2016-75934-C4-3-R es_ES
dc.relation AGENCIA ESTATAL DE INVESTIGACION/TEC2016-75934-C4-1-R es_ES
dc.relation.ispartof IEEE Transactions on Components, Packaging and Manufacturing Technology (Online) es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Soldering es_ES
dc.subject Tin es_ES
dc.subject Prototypes es_ES
dc.subject Reliability es_ES
dc.subject Substrates es_ES
dc.subject Contacts es_ES
dc.subject Electromagnetic waveguides es_ES
dc.subject Empty substrate integrated waveguide (ESIW) es_ES
dc.subject Fabrication es_ES
dc.subject Multilayer es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/TCPMT.2019.2915688 es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Martinez, JA.; Belenguer, A.; Esteban González, H. (2019). Highly Reliable and Repeatable Soldering Technique for Assembling Empty Substrate Integrated Waveguide Devices. IEEE Transactions on Components, Packaging and Manufacturing Technology (Online). 9(11):2276-2281. https://doi.org/10.1109/TCPMT.2019.2915688 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion https://doi.org/10.1109/TCPMT.2019.2915688 es_ES
dc.description.upvformatpinicio 2276 es_ES
dc.description.upvformatpfin 2281 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 9 es_ES
dc.description.issue 11 es_ES
dc.identifier.eissn 2156-3985 es_ES
dc.relation.pasarela S\397153 es_ES
dc.contributor.funder Agencia Estatal de Investigación es_ES
dc.contributor.funder Ministerio de Economía, Industria y Competitividad es_ES


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