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dc.contributor.author | McDonald, Carol![]() |
es_ES |
dc.contributor.author | Rannow, Randy K.![]() |
es_ES |
dc.contributor.author | Pai, Dinesh![]() |
es_ES |
dc.contributor.author | Bullas, Alice![]() |
es_ES |
dc.contributor.author | Ballester Fernandez, Alfredo![]() |
es_ES |
dc.date.accessioned | 2021-09-03T03:34:28Z | |
dc.date.available | 2021-09-03T03:34:28Z | |
dc.date.issued | 2020-09 | es_ES |
dc.identifier.issn | 2162-2248 | es_ES |
dc.identifier.uri | http://hdl.handle.net/10251/171333 | |
dc.language | Inglés | es_ES |
dc.publisher | Institute of Electrical and Electronics Engineers | es_ES |
dc.relation.ispartof | IEEE Consumer Electronics Magazine | es_ES |
dc.rights | Reserva de todos los derechos | es_ES |
dc.subject | Three-dimensional displays | es_ES |
dc.subject | Standards | es_ES |
dc.subject | Measurement by laser beam | es_ES |
dc.subject | Integrated circuits | es_ES |
dc.subject | Consumer electronics | es_ES |
dc.subject | Industries | es_ES |
dc.subject | Surface reconstruction | es_ES |
dc.title | IEEE SA Industry Connections 3-D Body Processing Working Group and IEEE P3141 Standard for 3-D Body Processing - Part 1 | es_ES |
dc.type | Artículo | es_ES |
dc.identifier.doi | 10.1109/MCE.2020.2993015 | es_ES |
dc.rights.accessRights | Cerrado | es_ES |
dc.description.bibliographicCitation | Mcdonald, C.; Rannow, RK.; Pai, D.; Bullas, A.; Ballester Fernandez, A. (2020). IEEE SA Industry Connections 3-D Body Processing Working Group and IEEE P3141 Standard for 3-D Body Processing - Part 1. IEEE Consumer Electronics Magazine. 9(5):62-63. https://doi.org/10.1109/MCE.2020.2993015 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | https://doi.org/10.1109/MCE.2020.2993015 | es_ES |
dc.description.upvformatpinicio | 62 | es_ES |
dc.description.upvformatpfin | 63 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 9 | es_ES |
dc.description.issue | 5 | es_ES |
dc.relation.pasarela | S\434135 | es_ES |