Resumen:
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[EN] Silicon Carbide (SiC) is a lightweight material which is used in the fabrication of
large space mirrors, of more than 500 millimetres diameter, and with a target of
achieving an optical surface thickness of less ...[+]
[EN] Silicon Carbide (SiC) is a lightweight material which is used in the fabrication of
large space mirrors, of more than 500 millimetres diameter, and with a target of
achieving an optical surface thickness of less than 1.5 millimetres. SiC is used
in space optic applications, such as Earth observation cameras and space
satellites, not only because of its lightweight properties, but also because of its
mechanical properties like high stiffness and thermal properties like low thermal
expansion. SiC has been one of the most used materials for space application
mirrors since the nineties when the development of the processes and
equipment was produced.
Plasma process is the last of the machining processes during the manufacturing
phase, after grinding and polishing. Throughout this project a support for this
manufacturing process is done based on Finite Element Analysis. This is done
by developing thermal and structural transient model with commercial code
software (Abaqus). For this purpose, the different parameters which affect
during plasma process heat transfer modelling results are analysed taking into
consideration static test cases, which experimental data is supplied.
3D models are developed to represent plasma process. After the study of the
plasma process static test cases, welding thermal and structural model is
created and compared with literature available, in order to model a similar
process. A plug-in available for Abaqus, Abaqus Welding Interface, is used for
the generation of welding simulations. Comparison with literature simulation
results is not completely satisfactory, and for this reason just general trends are
indicated in the case of a dynamic plasma heat source. Recommendations for
modelling plasma process are made, including: 1) heat input application as
surface heat flux or volume target temperature of elements affected by heat
source if known can be implemented, 2) a further study of the film coefficient
applied to the model according to the experiment should be done, as this have
strong influence in the cooling after plasma process, and 3) radiation losses can
be neglected since its effect is minimum and does not any relevant effect over
temperatures in the plate, and consequently in residual stress appearing
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