Palanca Cámara, J.; Rincón-Arango, JA.; Julian, V.; Carrascosa Casamayor, C.; Terrasa Barrena, AM. (2022). Developing IoT Artifacts in a MAS Platform. Electronics. 11(4):1-16. https://doi.org/10.3390/electronics11040655
Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/193200
Title:
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Developing IoT Artifacts in a MAS Platform
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Author:
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Palanca Cámara, Javier
Rincón-Arango, Jaime Andrés
Julian, Vicente
Carrascosa Casamayor, Carlos
Terrasa Barrena, Andrés Martín
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UPV Unit:
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Universitat Politècnica de València. Escuela Politécnica Superior de Gandia - Escola Politècnica Superior de Gandia
Universitat Politècnica de València. Escola Tècnica Superior d'Enginyeria Informàtica
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Issued date:
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Abstract:
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[EN] The Internet of Things (IoT) is a growing computational paradigm where all kinds of everyday objects are interconnected, forming a vast cyberphysical environment at the edge between the virtual and the real world. ...[+]
[EN] The Internet of Things (IoT) is a growing computational paradigm where all kinds of everyday objects are interconnected, forming a vast cyberphysical environment at the edge between the virtual and the real world. Since the emergence of the IoT, Multi-Agent Systems (MAS) technology has been successfully applied in this area, proving itself to be an appropriate paradigm for developing distributed, intelligent systems containing sets of IoT devices. However, this technology still lacks effective mechanisms to integrate the enormous diversity of existing IoT devices systematically. In this context, this paper introduces the concept of the IoT artifact as a new interface abstraction for the development of MAS based on IoT devices. The IoT artifact strictly conforms to the Agents and Artifacts (A&A) meta-model, and it also adopts the programming model of the SPADE multi-agent platform, providing both a consistent theoretical framework and a practical model for real-world applications.
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Subjects:
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Multi-agent systems
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IoT
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Agent platforms
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Artifacts
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Copyrigths:
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Reconocimiento (by)
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Source:
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Electronics. (eissn:
2079-9292
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DOI:
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10.3390/electronics11040655
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Publisher:
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MDPI AG
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Publisher version:
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https://doi.org/10.3390/electronics11040655
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Coste APC:
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1110 €
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Project ID:
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info:eu-repo/grantAgreement/AEI//RTI2018-095390-B-C31-AR//HACIA UNA MOVILIDAD INTELIGENTE Y SOSTENIBLE SOPORTADA POR SISTEMAS MULTI-AGENTES Y EDGE COMPUTING/
info:eu-repo/grantAgreement/UPV-VIN//PAID-10-19//Redes de sensores inteligentes en el entorno de las Smart Cities./
info:eu-repo/grantAgreement/GENERALITAT VALENCIANA//PROMETEO%2F2018%2F002//TECNOLOGIES PER ORGANITZACIONS HUMANES EMOCIONALS/
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Thanks:
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This work is partially supported by Grant RTI2018-095390-B-C31 funded by MCIN/AEI/10.13039/501100011033 and by "ERDF A way of making Europe", by the Universitat Politecnica de Valencia (Research Project PAID-10-19), and ...[+]
This work is partially supported by Grant RTI2018-095390-B-C31 funded by MCIN/AEI/10.13039/501100011033 and by "ERDF A way of making Europe", by the Universitat Politecnica de Valencia (Research Project PAID-10-19), and the Generalitat Valenciana (Project PROMETEO/2018/002).
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Type:
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Artículo
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