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dc.contributor.author | She, Jinhua | es_ES |
dc.contributor.author | Guzman-Miranda, Hipolito | es_ES |
dc.contributor.author | Huang, Victor | es_ES |
dc.contributor.author | Chen, Allen C. | es_ES |
dc.contributor.author | Karnouskos, Stamatis | es_ES |
dc.contributor.author | Dunai, Larisa | es_ES |
dc.contributor.author | Ma, Chengbin | es_ES |
dc.contributor.author | Tisan, Alin | es_ES |
dc.contributor.author | Yokota, Sho | es_ES |
dc.date.accessioned | 2024-04-11T07:38:12Z | |
dc.date.available | 2024-04-11T07:38:12Z | |
dc.date.issued | 2022 | es_ES |
dc.identifier.uri | http://hdl.handle.net/10251/203314 | |
dc.description.abstract | [EN] How to build a sustainable society in view of industrial electronics has been discussed from energy, information and communication technologies, cyber-physical systems (CPSs), and other viewpoints. This paper presents a cross-disciplinary view that integrates the fields of human factors, professional education, electronic systems on chip, resilience and security for industrial applications, technology ethics and society, and standards. After explaining the efforts and challenges in these fields, this paper shows a methodology for cross-disciplinary technology that integrates the technical committees in Cluster 4, Industrial Electronics Society. A project, which was launched in March 2022, implements a 'Proof of Concept' trial of the methodology. | es_ES |
dc.description.sponsorship | The work of Jinhua Sh was supported by JSPS Grant-in-Aid for Scientific Research B under Grant 22H03998 (Japan). | es_ES |
dc.language | Inglés | es_ES |
dc.publisher | IEEE | es_ES |
dc.relation.ispartof | IEEE Journal of Emerging and Selected Topics in Industrial Electronics (Online) | es_ES |
dc.rights | Reconocimiento (by) | es_ES |
dc.subject | Industrial Electronics | es_ES |
dc.subject | Enginering | es_ES |
dc.subject | Industries | es_ES |
dc.subject | Human factors | es_ES |
dc.subject | Standards | es_ES |
dc.subject | Education | es_ES |
dc.subject | Ethics | es_ES |
dc.subject | System-on-chip | es_ES |
dc.subject | Cross-disciplinary technology | es_ES |
dc.subject | Electronic systems on chip | es_ES |
dc.subject | Resilience and security for industrial applications | es_ES |
dc.subject | Professional education | es_ES |
dc.subject | Technology ethics | es_ES |
dc.subject | Sustainable society | es_ES |
dc.subject.classification | EXPRESION GRAFICA EN LA INGENIERIA | es_ES |
dc.title | A Cross-Disciplinary Outlook of Directions and Challenges in Industrial Electronics | es_ES |
dc.type | Artículo | es_ES |
dc.identifier.doi | 10.1109/OJIES.2022.3174218 | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/MEXT//22H03998/ | es_ES |
dc.rights.accessRights | Abierto | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Escuela Técnica Superior de Ingenieros Industriales - Escola Tècnica Superior d'Enginyers Industrials | es_ES |
dc.description.bibliographicCitation | She, J.; Guzman-Miranda, H.; Huang, V.; Chen, AC.; Karnouskos, S.; Dunai, L.; Ma, C.... (2022). A Cross-Disciplinary Outlook of Directions and Challenges in Industrial Electronics. IEEE Journal of Emerging and Selected Topics in Industrial Electronics (Online). 3:375-391. https://doi.org/10.1109/OJIES.2022.3174218 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | https://doi.org/10.1109/OJIES.2022.3174218 | es_ES |
dc.description.upvformatpinicio | 375 | es_ES |
dc.description.upvformatpfin | 391 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 3 | es_ES |
dc.identifier.eissn | 2687-9743 | es_ES |
dc.relation.pasarela | S\468488 | es_ES |
dc.contributor.funder | Ministry of Education, Culture, Sports, Science and Technology, Japón | es_ES |