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Additive manufacturing and metallization of high-frequency communication devices

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Additive manufacturing and metallization of high-frequency communication devices

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dc.contributor.author Bachiller Martin, Maria Carmen es_ES
dc.contributor.author Nova-Giménez, Vicente es_ES
dc.contributor.author Ferrer, Álvaro es_ES
dc.contributor.author Martínez, Asunción es_ES
dc.contributor.author Sandoval, Nacho es_ES
dc.contributor.author Marín García, Mª Luisa es_ES
dc.contributor.author Ponce-Gonzalez, Luis Nicolas es_ES
dc.date.accessioned 2024-05-02T18:08:26Z
dc.date.available 2024-05-02T18:08:26Z
dc.date.issued 2023-02 es_ES
dc.identifier.issn 2363-9512 es_ES
dc.identifier.uri http://hdl.handle.net/10251/203928
dc.description.abstract [EN] Additive manufacturing (AM) can be applied to new scenarios where traditional subtractive techniques limit geometry and assembling freedom. One of these scenarios is the development of high-frequency devices for communication systems, where AM offers the capability to develop high-complexity geometries, reducing the devices' weight and cost. This is extraordinarily convenient for recent small satellites where size, weight, and integration are vital. This work presents an AM process specially optimized to develop communication devices. Industry needs have been studied, and materials and manufacturing techniques have been chosen accordingly. Two communication devices, a band-pass filter and a horn antenna, have been developed using two VAT photopolymerization (VPP) processes and different resins. Printed devices were metallized using a two-step process based on a first electroless metallisation and a final galvanic plating. The manufactured pieces were sandblasted prior to metallization to increase plating adhesion and reduce surface roughness. Finally, several dimensional analyses were performed to evaluate the effect of finishing and plating on the manufacturing process using scanning electron microscopy, profilometry, and contact metrology. The electromagnetic response of developed devices is excellent and comparable with commercial devices manufactured with subtractive techniques. A preliminary tolerance analysis was carried out to approximate the systematic deviation of the overall manufacturing process, considering the erosion of sandblasting and the thickness of copper plating. These deviations were compensated in the design step to improve the dimensional accuracy of the band-pass filter. es_ES
dc.description.sponsorship This work was supported by the Agencia Valenciana de la Innovación research project INNVA1/2020/84, by the Agencia Estatal de Investigación (Spain) under the Fellowship for Training PhDs BES-2017-079728, and by the Ministerio de Ciencia e Innovación (MICIN, Spanish Government) through the Research and Development projectPID2019-103982RB-C41 (under Grant MICIN/ AEI/10. 13039/501100011033). Open Access funding provided thanks to the CRUE-CSIC agreement with Springer Nature. es_ES
dc.language Inglés es_ES
dc.publisher Springer es_ES
dc.relation.ispartof Progress in Additive Manufacturing es_ES
dc.rights Reconocimiento (by) es_ES
dc.subject Metallization es_ES
dc.subject Additive manufacturing es_ES
dc.subject VAT photopolymerization es_ES
dc.subject High-frequency es_ES
dc.subject Communication es_ES
dc.subject Antennas es_ES
dc.subject Filters es_ES
dc.subject.classification TEORÍA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.subject.classification QUIMICA ORGANICA es_ES
dc.title Additive manufacturing and metallization of high-frequency communication devices es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1007/s40964-022-00386-4 es_ES
dc.relation.projectID info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-103982RB-C41/ES/DISEÑO AVANZADO DE NUEVOS COMPONENTES DE ALTA FRECUENCIA EN TECNOLOGIAS GUIADAS COMPACTAS PARA FUTUROS SATELITES DE TELECOMUNICACION/ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/AEI//BES-2017-079728//AYUDAS PARA CONTRATOS PREDOCTORALES PARA LA FORMACION DE DOCTORES 2017-NOVA GIMENEZ. PROYECTO: DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALES./ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/AGENCIA VALENCIANA DE LA INNOVACION//INNVA1%2F2020%2F84//VALORIZACIÓN DE UN MÉTODO DE FABRICACIÓN 3D, METALIZACIÓN E INTEGRACIÓN DE DISPOSITIVOS DE ALTA FRECUENCIA/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia es_ES
dc.contributor.affiliation Universitat Politècnica de València. Escuela Técnica Superior de Ingenieros de Telecomunicación - Escola Tècnica Superior d'Enginyers de Telecomunicació es_ES
dc.contributor.affiliation Universitat Politècnica de València. Escuela Técnica Superior de Ingenieros Industriales - Escola Tècnica Superior d'Enginyers Industrials es_ES
dc.description.bibliographicCitation Bachiller Martin, MC.; Nova-Giménez, V.; Ferrer, Á.; Martínez, A.; Sandoval, N.; Marín García, ML.; Ponce-Gonzalez, LN. (2023). Additive manufacturing and metallization of high-frequency communication devices. Progress in Additive Manufacturing. 8(1):3-8. https://doi.org/10.1007/s40964-022-00386-4 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion https://doi.org/10.1007/s40964-022-00386-4 es_ES
dc.description.upvformatpinicio 3 es_ES
dc.description.upvformatpfin 8 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 8 es_ES
dc.description.issue 1 es_ES
dc.relation.pasarela S\481665 es_ES
dc.contributor.funder AGENCIA ESTATAL DE INVESTIGACION es_ES
dc.contributor.funder AGENCIA VALENCIANA DE LA INNOVACION es_ES
dc.subject.ods 09.- Desarrollar infraestructuras resilientes, promover la industrialización inclusiva y sostenible, y fomentar la innovación es_ES
dc.subject.ods 12.- Garantizar las pautas de consumo y de producción sostenibles es_ES


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