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Integrated Microwave Photonics Coherent Processor for Massive-MIMO Systems in Wireless Communications

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Integrated Microwave Photonics Coherent Processor for Massive-MIMO Systems in Wireless Communications

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dc.contributor.author Martínez-Carrasco Romero, Pablo es_ES
dc.contributor.author Rausell-Campo, Jose Roberto es_ES
dc.contributor.author Pérez-Galacho, Diego es_ES
dc.contributor.author Li, Xu es_ES
dc.contributor.author Qing, Ting es_ES
dc.contributor.author Pérez-López, Daniel es_ES
dc.contributor.author Wang, Tiangxiang es_ES
dc.date.accessioned 2024-07-01T18:37:43Z
dc.date.available 2024-07-01T18:37:43Z
dc.date.issued 2023-11 es_ES
dc.identifier.issn 1077-260X es_ES
dc.identifier.uri http://hdl.handle.net/10251/205662
dc.description.abstract [EN] Massive-MIMO systems can achieve high capacities and data rates by increasing the number of operational antennas in the base station. As more antenna elements are introduced, the complexity of the signal processing operations increases accordingly and current electronic processors struggle to reach those requirements. To overcome these hurdles, we propose a novel theory to process the RF signals in the optical domain. We experimentally demonstrate the capabilities of theory using a non-integrated Dual Parallel Modulator as a 2×2 optical matrix multiplier, recovering satisfactorily previously mixed RF signals modulated following the standards in 5G communications. Finally, we propose an integrated photonic architecture based on a core of Mach Zehnder Interferometers to physically process the information. Together with the optical core, we proposed the integration of RF modulators, microwave photonic filters and high-speed photodetectors.We present simulations on the expected performance of the circuit and analyze the impact of fabrication errors. es_ES
dc.description.sponsorship The work of Jose Roberto Rausell-Campo was supported by the Polythecnic University of Valencia through FPI-UPV Program under Grant PAID-01-20-24. This work was supported by the UPV-Huawei Wireless Joint Innovation Center Agreement under Project YBN2020095120. es_ES
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers es_ES
dc.relation.ispartof IEEE Journal of Selected Topics in Quantum Electronics es_ES
dc.rights Reconocimiento (by) es_ES
dc.subject Optical filters es_ES
dc.subject Adaptive optics es_ES
dc.subject Optical modulation es_ES
dc.subject RF signals es_ES
dc.subject Optical signal processing es_ES
dc.subject Radio frequency es_ES
dc.subject Microwave filters es_ES
dc.subject Coherent photonic processor es_ES
dc.subject Integrated microwave photonics es_ES
dc.subject Mach Zehnder interferometers es_ES
dc.subject Massive-MIMO es_ES
dc.subject Photonic MIMO es_ES
dc.subject Wireless communications es_ES
dc.title Integrated Microwave Photonics Coherent Processor for Massive-MIMO Systems in Wireless Communications es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/JSTQE.2023.3264434 es_ES
dc.relation.projectID info:eu-repo/grantAgreement/UPV//PAID-01-20-24/ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/Huawei Technologies Canada Co., Ltd.//YBN2020095120/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia es_ES
dc.description.bibliographicCitation Martínez-Carrasco Romero, P.; Rausell-Campo, JR.; Pérez-Galacho, D.; Li, X.; Qing, T.; Pérez-López, D.; Wang, T. (2023). Integrated Microwave Photonics Coherent Processor for Massive-MIMO Systems in Wireless Communications. IEEE Journal of Selected Topics in Quantum Electronics. 29(6). https://doi.org/10.1109/JSTQE.2023.3264434 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion https://doi.org/10.1109/JSTQE.2023.3264434 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 29 es_ES
dc.description.issue 6 es_ES
dc.relation.pasarela S\498536 es_ES
dc.contributor.funder Huawei Technologies Canada Co., Ltd. es_ES
dc.contributor.funder Universitat Politècnica de València es_ES
upv.costeAPC 4980 es_ES


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