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Ubiquitous E-Maintenance Proposal Based on the Integration of Mobile Devices and Cloud Computing

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Ubiquitous E-Maintenance Proposal Based on the Integration of Mobile Devices and Cloud Computing

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dc.contributor.author Capella Hernández, Juan Vicente es_ES
dc.contributor.author Perles Ivars, Ángel Francisco es_ES
dc.contributor.author Martínez Rubio, Juan Miguel es_ES
dc.contributor.author Hassan Mohamed, Houcine es_ES
dc.contributor.author Domínguez Montagud, Carlos Pascual es_ES
dc.contributor.author Albaladejo Meroño, José es_ES
dc.date.accessioned 2013-06-21T12:43:39Z
dc.date.issued 2012
dc.identifier.issn 1936-6612
dc.identifier.uri http://hdl.handle.net/10251/29964
dc.description.abstract [EN] Most e-maintenance approaches are oriented to big industries and are prohibitive for modest industries. This paper proposes an architecture for e-maintenance that tries to solve this gap. This architecture defines two domains, the floor-shop and the cloud domain. In the floor-shop domain, a mobile device is connected to the system to be maintained by means of a tether-free process interface. On the other hand, the cloud domain provides the resources to improve the maintenance in instrumented manufacturing systems via Internet connection. Also, the mobile device is responsible for joining both domains through its Internet capabilities. The proposed architecture combines mobile devices, cloud computing and Internet connectivity, allowing fresh technicians to supply its lack of expertise, reducing maintenance task time and minimizing the expert technician dependency. The expert now changes his role because his physical presence at the floor-shop domain is not required, being his know-how incorporated to the system. The proposal is human-centric, providing an intuitive usability such as any typical smartphone app. The results show that it is feasible to reduce drastically the economic requirements for deploying complex e-maintenance infrastructures, increasing the quality of the maintenance and enabling the applicability to small factories where maintenance is mostly outsourced. This is translated to higher availability and productivity of the manufacturing plant. es_ES
dc.description.sponsorship This work has been partially supported by Spanish MICINN project TIN2011-28435-C03-01.
dc.language Inglés es_ES
dc.publisher American Scientific Publishers es_ES
dc.relation.ispartof Advanced Science Letters es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Mobile device es_ES
dc.subject E-maintenance es_ES
dc.subject Cloud computing es_ES
dc.subject Ubiquitous technologies es_ES
dc.subject Maintenance skills es_ES
dc.subject.classification ARQUITECTURA Y TECNOLOGIA DE COMPUTADORES es_ES
dc.title Ubiquitous E-Maintenance Proposal Based on the Integration of Mobile Devices and Cloud Computing es_ES
dc.type Artículo es_ES
dc.embargo.lift 10000-01-01
dc.embargo.terms forever es_ES
dc.identifier.doi 10.1166/asl.2012.4875
dc.relation.projectID info:eu-repo/grantAgreement/MICINN//TIN2011-28435-C03-01/ES/INVESTIGACION EN LA MEJORA DE LA CONFIABILIDAD DE APLICACIONES BASADAS EN WSN MEDIANTE EL DESARROLLO DE UNA PLATAFORMA HIBRIDA DE MONITORIZACION/ es_ES
dc.rights.accessRights Cerrado es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Informática de Sistemas y Computadores - Departament d'Informàtica de Sistemes i Computadors es_ES
dc.description.bibliographicCitation Capella Hernández, JV.; Perles Ivars, ÁF.; Martínez Rubio, JM.; Hassan Mohamed, H.; Domínguez Montagud, CP.; Albaladejo Meroño, J. (2012). Ubiquitous E-Maintenance Proposal Based on the Integration of Mobile Devices and Cloud Computing. Advanced Science Letters. 18:121-131. https://doi.org/10.1166/asl.2012.4875 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://doi.org/10.1166/asl.2012.4875 es_ES
dc.description.upvformatpinicio 121 es_ES
dc.description.upvformatpfin 131 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 18 es_ES
dc.relation.senia 240714
dc.contributor.funder Ministerio de Ciencia e Innovación


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