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Morphological and statistical analysis of biomaterials with applications in tissue engineering by means of microscopy image processing

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Morphological and statistical analysis of biomaterials with applications in tissue engineering by means of microscopy image processing

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Cardona Marsal, R.; Salmerón Sánchez, M.; Vallés Lluch, A.; Moratal Pérez, D. (2011). Morphological and statistical analysis of biomaterials with applications in tissue engineering by means of microscopy image processing. IEEE Latin America Transactions. 9(3):406-414. doi:10.1109/TLA.2011.5893789

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/37943

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Title: Morphological and statistical analysis of biomaterials with applications in tissue engineering by means of microscopy image processing
Author:
UPV Unit: Universitat Politècnica de València. Departamento de Física Aplicada - Departament de Física Aplicada
Universitat Politècnica de València. Departamento de Termodinámica Aplicada - Departament de Termodinàmica Aplicada
Universitat Politècnica de València. Departamento de Ingeniería Electrónica - Departament d'Enginyeria Electrònica
Universitat Politècnica de València. Centro de Biomateriales e Ingeniería Tisular - Centre de Biomaterials i Enginyeria Tissular
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Abstract:
This work presents the software implementation of a tissue engineering image analysis tool through the study of several biomaterials by means of different microscopy techniques (optical, scanning electron, and atomic force ...[+]
Subjects: Digital image processing , Microscopy image analysis , Morphological characteristics extraction , Quantification , Image analysis tools , Mean size , Microscopy images , Microscopy technique , Morphological characteristic , Quantitative information , Scanning electrons , Software implementation , Atomic force microscopy , Image analysis , Imaging systems , Optical data processing , Statistical methods , Tissue , Tissue engineering
Copyrigths: Cerrado
Source:
IEEE Latin America Transactions. (issn: 1548-0992 )
DOI: 10.1109/TLA.2011.5893789
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publisher version: http://dx.doi.org/10.1109/TLA.2011.5893789
Type: Artículo

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