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Hybrid Technique Plus Fast Frequency Sweep for the Efficient and Accurate Analysis of Substrate Integrated Waveguide Devices

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Hybrid Technique Plus Fast Frequency Sweep for the Efficient and Accurate Analysis of Substrate Integrated Waveguide Devices

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Belenguer Martínez, Á.; Esteban González, H.; Díaz Caballero, E.; Bachiller Martin, MC.; Cascon Lopez, J.; Boria Esbert, VE. (2011). Hybrid Technique Plus Fast Frequency Sweep for the Efficient and Accurate Analysis of Substrate Integrated Waveguide Devices. IEEE Transactions on Microwave Theory and Techniques. 59(3):552-560. doi:10.1109/TMTT.2010.2098884

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/38098

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Title: Hybrid Technique Plus Fast Frequency Sweep for the Efficient and Accurate Analysis of Substrate Integrated Waveguide Devices
Author:
UPV Unit: Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia
Issued date:
Abstract:
In this paper, we adapt a novel mode-matching and method-of-moments hybrid technique to efficiently analyze substrate integrated waveguide (SIW) based devices. The hybrid technique is formulated in terms of a single ...[+]
Subjects: Electromagnetic (EM) analysis , Microwave filters , Modal analysis , Mode matching , Moment method , Substrate integrated waveguides (SIWs) , Accurate analysis , Analysis and design , Commercial software , Electromagnetic analysis , Equivalent currents , Frequency sweep , Hybrid formulations , Hybrid techniques , System of equations , Electric filters , Electromagnetism , Integration , Method of moments , Microwave circuits , Scattering parameters , Substrates , Substrate integrated waveguides
Copyrigths: Cerrado
Source:
IEEE Transactions on Microwave Theory and Techniques. (issn: 0018-9480 )
DOI: 10.1109/TMTT.2010.2098884
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publisher version: http://dx.doi.org/10.1109/TMTT.2010.2098884
Thanks:
This work was supported by the Ministerio de Ciencia e Innovacion, Spanish Government, under Research Project TEC2007-67630-C03-01 and by the Autonomous Government of Castilla-La Mancha under Research Project PPII10-0047-0220.[+]
Type: Artículo

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