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Novel empty substrate integrated waveguide for high performance microwave integrated circuits

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Novel empty substrate integrated waveguide for high performance microwave integrated circuits

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dc.contributor.author Belenguer Martínez, Ángel es_ES
dc.contributor.author Esteban González, Héctor es_ES
dc.contributor.author Boria Esbert, Vicente Enrique es_ES
dc.date.accessioned 2015-09-08T10:05:57Z
dc.date.available 2015-09-08T10:05:57Z
dc.date.issued 2014-04
dc.identifier.issn 0018-9480
dc.identifier.uri http://hdl.handle.net/10251/54391
dc.description "(c) 20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works." es_ES
dc.description.abstract Abstract Over the last years, a great number of substrate integrated circuits has been developed. These new circuits are a compromise between the advantages of classical waveguide technologies, such as high quality factor and low losses, and the advantages of planar circuits, such as low cost and easy compact integration. Although their quality factor and losses are better than for planar circuits, these characteristics are worse than in the case of waveguides, mainly due to the presence of the dielectric substrate. In order to improve the performance of the integrated circuits, a new methodology for manufacturing empty waveguides, without a dielectric substrate, but at the same time completely integrated in a planar substrate, is proposed in this work. A wideband transition with return losses greater than 20 dB in the whole bandwith of the waveguide allows the integration of the empty waveguide into the planar substrate so that the waveguide can be directly accessed with a microstrip line. Therefore, a microwave circuit integrated in a planar substrate, but at the same time with a very high quality factor (measured quality factor is 4.5 times higher than for the same filter in the substrate integrated waveguide), and very low losses is successfully achieved. es_ES
dc.description.sponsorship This work was supported by the Ministerio de Ciencia e Innovacion, Spanish Goverment, under Research Project TEC2010-21520-C04-03 and Research Project EC2010-21520-C04-01, and by the Autonomous Government of Castilla-La Mancha under Research Project PPII10-0047-0220. en_EN
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) es_ES
dc.relation.ispartof IEEE Transactions on Microwave Theory and Techniques es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Empty substrate integrated waveguide (ESIW) es_ES
dc.subject Q-factor es_ES
dc.subject Rectangular waveguide es_ES
dc.subject Substrate integrated circuit (SIC) es_ES
dc.subject Substrate integrated waveguides (SIW) es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title Novel empty substrate integrated waveguide for high performance microwave integrated circuits es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/TMTT.2014.2309637
dc.relation.projectID info:eu-repo/grantAgreement/MICINN//TEC2010-21520-C04-03/ES/NUEVAS TOPOLOGIAS DE CIRCUITOS PASIVOS BASADOS EN TECNOLOGIA DE GUIAS INTEGRADAS EN SUBSTRATOS Y METAMATERIALES PARA COMUNICACIONES ESPACIALES/ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/MICINN//TEC2010-21520-C04-01/ES/DESARROLLO TECNOLOGICO AVANZADO DE DISPOSITIVOS PASIVOS EN TECNOLOGIA GUIADA PARA CARGAS UTILES DE SATELITES/ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/JCCM//PPII10-0047-0220/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Belenguer Martínez, Á.; Esteban González, H.; Boria Esbert, VE. (2014). Novel empty substrate integrated waveguide for high performance microwave integrated circuits. IEEE Transactions on Microwave Theory and Techniques. 62(4):832-839. https://doi.org/10.1109/TMTT.2014.2309637 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://dx.doi.org/10.1109/TMTT.2014.2309637 es_ES
dc.description.upvformatpinicio 832 es_ES
dc.description.upvformatpfin 839 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 62 es_ES
dc.description.issue 4 es_ES
dc.relation.senia 265441 es_ES
dc.contributor.funder Ministerio de Ciencia e Innovación es_ES
dc.contributor.funder Junta de Comunidades de Castilla-La Mancha es_ES


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