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A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits

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A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits

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Muller, AA.; Soto Pacheco, P.; Dascalu, D.; Neculoiu, D.; Boria Esbert, VE. (2011). A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits. IEEE Microwave and Wireless Components Letters. 21(6):286-288. https://doi.org/10.1109/LMWC.2011.2132697

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/55107

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Title: A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits
Author: Muller, Andrei A. Soto Pacheco, Pablo Dascalu, Dan Neculoiu, Dan Boria Esbert, Vicente Enrique
UPV Unit: Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia
Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Issued date:
Abstract:
This letter proposes a spherical 3-D Smith Chart suitable for representing both active and passive microwave circuits. Using the mathematical concept of the Riemann sphere, the extended reflection coefficient plane is ...[+]
Subjects: Active circuits , Immittance , Lossy circuits , Reflection coefficient , Smith Chart , Transmission lines , Microwave circuits , Microwave devices , Reflection , Spheres , Three dimensional , Passive networks
Copyrigths: Reserva de todos los derechos
Source:
IEEE Microwave and Wireless Components Letters. (issn: 1531-1309 )
DOI: 10.1109/LMWC.2011.2132697
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publisher version: http://dx.doi.org/10.1109/LMWC.2011.2132697
Project ID:
info:eu-repo/grantAgreement/ESF//POSDRU%2F7713/
info:eu-repo/grantAgreement/MICINN//TEC2010-21520-C04-01/ES/DESARROLLO TECNOLOGICO AVANZADO DE DISPOSITIVOS PASIVOS EN TECNOLOGIA GUIADA PARA CARGAS UTILES DE SATELITES/
Description: “© © 20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.”
Thanks:
This work was supported in part by the POSDRU ID 7713 European Project and by the Ministerio de Ciencia e Innovacion, Spanish Government under Research Project TEC2010-21520-C04-01.
Type: Artículo

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