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Spatial Audio for Audioconferencing in Mobile Devices: Investigating the Importance of Virtual Mobility and Private Communication and Optimizations

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Spatial Audio for Audioconferencing in Mobile Devices: Investigating the Importance of Virtual Mobility and Private Communication and Optimizations

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Aguilera Martí, E.; López Monfort, JJ.; Cooperstock, JR. (2016). Spatial Audio for Audioconferencing in Mobile Devices: Investigating the Importance of Virtual Mobility and Private Communication and Optimizations. Journal of the Audio Engineering Society. 64(5):332-341. doi:10.17743/jaes.2016.0009

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/84401

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Title: Spatial Audio for Audioconferencing in Mobile Devices: Investigating the Importance of Virtual Mobility and Private Communication and Optimizations
Author: Aguilera Martí, Emanuel López Monfort, José Javier Cooperstock, Jeremy R.
UPV Unit: Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia
Universitat Politècnica de València. Escuela Técnica Superior de Ingenieros de Telecomunicación - Escola Tècnica Superior d'Enginyers de Telecomunicació
Issued date:
Abstract:
Audioconferencing systems are becoming increasingly sophisticated, seeking to improve immersion, intelligibility, and sense of presence. In parallel, mobile devices are gaining traction for such applications, often supplanting ...[+]
Subjects: Spatial audio , Audioconferencing , Binaural , Mobile , Internet , Perception , Interactive , Multimedia
Copyrigths: Cerrado
Source:
Journal of the Audio Engineering Society. (issn: 1549-4950 )
DOI: 10.17743/jaes.2016.0009
Publisher:
Audio Engineering Society
Publisher version: http://dx.doi.org/10.17743/jaes.2016.0009
Thanks:
The Spanish Ministry of Economy and Competitiveness supported this work under the project TEC2012-37945-C01. The experiments were carried out with the support of the Transatlantic Partnership for Excellence in Engineering ...[+]
Type: Artículo

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