Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials

Handle

https://riunet.upv.es/handle/10251/51952

Cita bibliográfica

Roa, JJ.; Rayón Encinas, E.; Morales, M.; Segarra, M. (2012). Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials. Recent Patents on Engineering. 6(2):142-152. doi:10.2174/187221212801227130

Titulación

Resumen

In the last years, Nanoindentation or Instrumented Indentation Technique has become a powerful tool to study the mechanical properties at micro/nanometric scale (commonly known as hardness, elastic modulus and the stress-strain curve). In this review, the different contact mechanisms (elastic and elasto-plastic) are discussed, the recent patents for each mechanism (elastic and elasto-plastic) are summarized in detail, and the basic equations employed to know the mechanical behaviour for brittle and ductile materials are described

Fuente

Recent Patents on Engineering issn: 1872-2121

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