Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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dc.contributor.authorZimmermann, Larses_ES
dc.contributor.authorPreve, Giovan Battistaes_ES
dc.contributor.authorTekin, Tolgaes_ES
dc.contributor.authorRosin, T.es_ES
dc.contributor.authorLandles, K.es_ES
dc.contributor.funderEuropean Commission
dc.date.accessioned2016-07-18T08:26:00Z
dc.date.available2016-07-18T08:26:00Z
dc.date.issued2011-05
dc.description.abstract[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devicesen_EN
dc.description.accrualMethodSes_ES
dc.description.bibliographicCitationZimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. https://doi.org/10.1109/JSTQE.2010.2084992es_ES
dc.description.issue3es_ES
dc.description.sponsorshipThis work was supported in part by the European Union (EU)-funded FP6-project ePIXnet, and in part by the FP7-project BOOM.
dc.description.upvformatpfin651es_ES
dc.description.upvformatpinicio645es_ES
dc.description.volume17es_ES
dc.identifier.doi10.1109/JSTQE.2010.2084992
dc.identifier.issn1077-260X
dc.identifier.urihttps://riunet.upv.es/handle/10251/67695
dc.languageIngléses_ES
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)es_ES
dc.relation.ispartofIEEE Journal of Selected Topics in Quantum Electronicses_ES
dc.relation.projectIDinfo:eu-repo/grantAgreement/EC/FP7/224375/EU/Terabit-on-chip: micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers/
dc.relation.projectIDinfo:eu-repo/grantAgreement/EC/FP6/004525/EU/European Network of Excellence on Photonic Integrated Components and Circuits/ePIXnet/es_ES
dc.relation.publisherversionhttp://dx.doi.org/10.1109/JSTQE.2010.2084992es_ES
dc.relation.senia222255es_ES
dc.rightsReserva de todos los derechoses_ES
dc.rights.accessRightsAbiertoes_ES
dc.subjectHybrid integrated-circuit packaginges_ES
dc.subjectPhotonic integrationes_ES
dc.subjectSilicon-on-insulator (SOI)es_ES
dc.titlePackaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platformes_ES
dc.typeArtículoes_ES
dc.type.versioninfo:eu-repo/semantics/publishedVersiones_ES
dspace.entity.typePublication
upv.uuided727529-2afe-4e72-9c0b-5700ebd95e67es_ES

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