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Joining of Cu to SS304 by microwave hybrid heating with Ni as interlayer

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Joining of Cu to SS304 by microwave hybrid heating with Ni as interlayer

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Tamang, S.; Aravindan, S. (2019). Joining of Cu to SS304 by microwave hybrid heating with Ni as interlayer. En AMPERE 2019. 17th International Conference on Microwave and High Frequency Heating. Editorial Universitat Politècnica de València. 98-104. https://doi.org/10.4995/AMPERE2019.2019.9813

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/130159

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Title: Joining of Cu to SS304 by microwave hybrid heating with Ni as interlayer
Author: Tamang, Siddharth Aravindan, S.
Issued date:
Abstract:
[EN] Joining of dissimilar pure Copper (Cu) to Stainless Steel (SS304) is necessitated in many industrial applications such as heat exchangers and electrical contacts. Advantages of both the materials such as high ...[+]
Subjects: Energy Production by Microwaves , Microwave CVD , EM Modelling , Microwave Material interaction , Dielectric Properties , Dielectric Properties Measurement , Solid State Microwave , Microwave Processing , Microwave Chemistry , Microwave applicators design , Microwave heating , Cu , SS304 , Joining Ni
Copyrigths: Reconocimiento - No comercial - Sin obra derivada (by-nc-nd)
ISBN: 9788490487198
Source:
AMPERE 2019. 17th International Conference on Microwave and High Frequency Heating.
DOI: 10.4995/AMPERE2019.2019.9813
Publisher:
Editorial Universitat Politècnica de València
Publisher version: http://ocs.editorial.upv.es/index.php/AMPERE2019/AMPERE2019/paper/view/9813
Conference name: Ampere 2019
Conference place: Valencia, Spain
Conference date: Septiembre 09-12, 2019
Type: Capítulo de libro Comunicación en congreso

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