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Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications

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Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications

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dc.contributor.author Brimont, Antoine Christian Jacques es_ES
dc.contributor.author Zurita Herranz, David es_ES
dc.contributor.author Duarte, V. C. es_ES
dc.contributor.author Mengual, T. es_ES
dc.contributor.author Chmielak, B. es_ES
dc.contributor.author Suckow, S. es_ES
dc.contributor.author Giesecke, A. es_ES
dc.contributor.author PIQUERAS RUIPÉREZ, MIGUEL ÁNGEL es_ES
dc.contributor.author Sanchis Kilders, Pablo es_ES
dc.date.accessioned 2021-12-21T06:57:07Z
dc.date.available 2021-12-21T06:57:07Z
dc.date.issued 2020-06-24 es_ES
dc.identifier.uri http://hdl.handle.net/10251/178658
dc.description.abstract [EN] In this work, we demonstrate an efficient fiber array-to-chip assembly process with a high number of input/output ports. The proposed approach is based on using a pre-alignment coupling structure to separately align the input and output ports. The assembling process has been experimentally validated in photonic integrated circuits fabricated with an ultra-low-loss waveguide technology based on silicon nitride, which features propagation losses as low as 9.5 dB/m. The developed technology is expected to extend the use of integrated photonics for space applications es_ES
dc.description.sponsorship This work was supported by EU-funded H2020 project RETINA under grant agreement n° 821943 es_ES
dc.language Inglés es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Silicon nitride es_ES
dc.subject Fiber-to-chip coupling es_ES
dc.subject Assembling es_ES
dc.subject Packaging. es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications es_ES
dc.type Comunicación en congreso es_ES
dc.relation.projectID info:eu-repo/grantAgreement/EC/H2020/821943/EU/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Tecnología Nanofotónica - Institut Universitari de Tecnologia Nanofotònica es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Brimont, ACJ.; Zurita Herranz, D.; Duarte, VC.; Mengual, T.; Chmielak, B.; Suckow, S.; Giesecke, A.... (2020). Optical fiber-to-chip assembly process for ultra-low loss photonic devices based on silicon nitride for space applications. 1-3. http://hdl.handle.net/10251/178658 es_ES
dc.description.accrualMethod S es_ES
dc.relation.conferencename 22nd European Conference on Integrated Optics (ECIO 2020) es_ES
dc.relation.conferencedate Junio 23-24,2020 es_ES
dc.relation.conferenceplace Paris, France es_ES
dc.relation.publisherversion https://www.ecio-conference.org/2020-proceedings/ es_ES
dc.description.upvformatpinicio 1 es_ES
dc.description.upvformatpfin 3 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.relation.pasarela S\421854 es_ES


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