- -

Noninvasive monitoring of polymer curing reactions by dielectrometry

RiuNet: Institutional repository of the Polithecnic University of Valencia

Share/Send to

Cited by


Noninvasive monitoring of polymer curing reactions by dielectrometry

Show full item record

García Baños, B.; Canós Marín, AJ.; Peñaranda Foix, FL.; Catalá Civera, JM. (2011). Noninvasive monitoring of polymer curing reactions by dielectrometry. IEEE Sensors Journal. 11(1):62-70. doi:10.1109/JSEN.2010.2050475

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/35125

Files in this item

Item Metadata

Title: Noninvasive monitoring of polymer curing reactions by dielectrometry
Author: García Baños, Beatriz Canós Marín, Antoni Josep Peñaranda Foix, Felipe Laureano Catalá Civera, José Manuel
UPV Unit: Universitat Politècnica de València. Instituto Universitario de Aplicaciones de las Tecnologías de la Información - Institut Universitari d'Aplicacions de les Tecnologies de la Informació
Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Issued date:
A microwave sensor system for the noninvasive monitoring of the curing process of a thermoset material placed inside a metallic mold is described. The microwave sensor is designed as an open-ended coaxial resonator with a ...[+]
Subjects: Coaxial resonators , Dielectric materials , Materials processing , Microwave devices , Plastics , Process monitoring , Continuous monitoring , Coupling network , Cure process , Curing process , Curing reactions , Curved surfaces , De-embedding , Dielectrometry , Initial conditions , Metallic mold , Microwave dielectric properties , Microwave resonators , Non-invasive monitoring , Polymeric material , Real time , Thermoset materials , Curing , Dielectric losses , Elastomers , Microwave sensors , Microwaves , Molds , Plasticity , Polymers , Process control , Resonators , Thermosets
Copyrigths: Cerrado
IEEE Sensors Journal. (issn: 1530-437X )
DOI: 10.1109/JSEN.2010.2050475
Institute of Electrical and Electronics Engineers (IEEE)
Publisher version: http://dx.doi.org/10.1109/JSEN.2010.2050475
The work of B. Garcia-Banos was supported by a contract from the Ministry of Science and Innovation of Spain, through the "Torres Quevedo" Sub-programme, which is also cofinanced by the European Social Fund (ESF). This ...[+]
Type: Artículo



This item appears in the following Collection(s)

Show full item record