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dc.contributor.author | García Baños, Beatriz | es_ES |
dc.contributor.author | Canós Marín, Antoni Josep | es_ES |
dc.contributor.author | Peñaranda Foix, Felipe Laureano | es_ES |
dc.contributor.author | Catalá Civera, José Manuel | es_ES |
dc.date.accessioned | 2014-01-24T16:42:27Z | |
dc.date.issued | 2011-01 | |
dc.identifier.issn | 1530-437X | |
dc.identifier.uri | http://hdl.handle.net/10251/35125 | |
dc.description.abstract | A microwave sensor system for the noninvasive monitoring of the curing process of a thermoset material placed inside a metallic mold is described. The microwave sensor is designed as an open-ended coaxial resonator with a curved surface adapted to the mold inner shape. The analysis of the microwave resonator comprises a recently developed method for deembedding the effect of coupling network in overcoupled resonators, so the range of permitted measurements encompass both low and high dielectric losses of polymeric materials. Results show that noninvasive, continuous monitoring of the microwave dielectric properties of the thermoset material can be performed in real time, allowing one to check initial conditions and to verify the evolution of the cure process. © 2006 IEEE. | es_ES |
dc.description.sponsorship | The work of B. Garcia-Banos was supported by a contract from the Ministry of Science and Innovation of Spain, through the "Torres Quevedo" Sub-programme, which is also cofinanced by the European Social Fund (ESF). This work was supported in part by the Comunitat Valenciana Government (IMPIVA - FEDER). The associate editor coordinating the review of this manuscript and approving it for publication was Prof. Evgeny Katz. | en_EN |
dc.format.extent | 9 | es_ES |
dc.language | Inglés | es_ES |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | es_ES |
dc.relation.ispartof | IEEE Sensors Journal | es_ES |
dc.rights | Reserva de todos los derechos | es_ES |
dc.subject | Coaxial resonators | es_ES |
dc.subject | Dielectric materials | es_ES |
dc.subject | Materials processing | es_ES |
dc.subject | Microwave devices | es_ES |
dc.subject | Plastics | es_ES |
dc.subject | Process monitoring | es_ES |
dc.subject | Continuous monitoring | es_ES |
dc.subject | Coupling network | es_ES |
dc.subject | Cure process | es_ES |
dc.subject | Curing process | es_ES |
dc.subject | Curing reactions | es_ES |
dc.subject | Curved surfaces | es_ES |
dc.subject | De-embedding | es_ES |
dc.subject | Dielectrometry | es_ES |
dc.subject | Initial conditions | es_ES |
dc.subject | Metallic mold | es_ES |
dc.subject | Microwave dielectric properties | es_ES |
dc.subject | Microwave resonators | es_ES |
dc.subject | Non-invasive monitoring | es_ES |
dc.subject | Polymeric material | es_ES |
dc.subject | Real time | es_ES |
dc.subject | Thermoset materials | es_ES |
dc.subject | Curing | es_ES |
dc.subject | Dielectric losses | es_ES |
dc.subject | Elastomers | es_ES |
dc.subject | Microwave sensors | es_ES |
dc.subject | Microwaves | es_ES |
dc.subject | Molds | es_ES |
dc.subject | Plasticity | es_ES |
dc.subject | Polymers | es_ES |
dc.subject | Process control | es_ES |
dc.subject | Resonators | es_ES |
dc.subject | Thermosets | es_ES |
dc.subject.classification | TEORIA DE LA SEÑAL Y COMUNICACIONES | es_ES |
dc.title | Noninvasive monitoring of polymer curing reactions by dielectrometry | es_ES |
dc.type | Artículo | es_ES |
dc.embargo.lift | 10000-01-01 | |
dc.embargo.terms | forever | es_ES |
dc.identifier.doi | 10.1109/JSEN.2010.2050475 | |
dc.rights.accessRights | Cerrado | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Instituto Universitario de Aplicaciones de las Tecnologías de la Información - Institut Universitari d'Aplicacions de les Tecnologies de la Informació | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions | es_ES |
dc.description.bibliographicCitation | García Baños, B.; Canós Marín, AJ.; Peñaranda Foix, FL.; Catalá Civera, JM. (2011). Noninvasive monitoring of polymer curing reactions by dielectrometry. IEEE Sensors Journal. 11(1):62-70. doi:10.1109/JSEN.2010.2050475 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | http://dx.doi.org/10.1109/JSEN.2010.2050475 | es_ES |
dc.description.upvformatpinicio | 62 | es_ES |
dc.description.upvformatpfin | 70 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 11 | es_ES |
dc.description.issue | 1 | es_ES |
dc.relation.senia | 39333 | |
dc.contributor.funder | Generalitat Valenciana | es_ES |
dc.contributor.funder | Ministerio de Ciencia e Innovación | es_ES |
dc.contributor.funder | European Social Fund | es_ES |