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Patent Overlay Mapping: Visualizing Technological Distance

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Patent Overlay Mapping: Visualizing Technological Distance

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Kay L.; Newman, N.; Youtie, J.; Porter A.L.; Rafols García, I. (2014). Patent Overlay Mapping: Visualizing Technological Distance. Journal of the American Society for Information Science and Technology. 65(12):2432-2443. doi:10.1002/asi.23146

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/44358

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Título: Patent Overlay Mapping: Visualizing Technological Distance
Autor: Kay L. Newman, N. Youtie, J. Porter A.L. Rafols García, Ismael
Entidad UPV: Universitat Politècnica de València. Instituto de Gestión de la Innovación y del Conocimiento - Institut de Gestió de la Innovació i del Coneixement
Fecha difusión:
Resumen:
This paper presents a new global patent map that represents all technological categories and a method to locate patent data of individual organizations and technological fields on the global map. This overlay map technique ...[+]
Palabras clave: Information mapping , Innovation , Patents
Derechos de uso: Reserva de todos los derechos
Fuente:
Journal of the American Society for Information Science and Technology. (issn: 1532-2882 )
DOI: 10.1002/asi.23146
Editorial:
Association for Information Science and Technology (ASIS&T): JASIS&T
Versión del editor: http://dx.doi.org/10.1002/asi.23146
Código del Proyecto:
info:eu-repo/grantAgreement/NSF//1064146/US/TLS: Revealing Innovation Pathways/
info:eu-repo/grantAgreement/NSF//0531184/US/NSEC: Center for Nanotechnology in Society at University of California, Santa Barbara/
info:eu-repo/grantAgreement/NSF//0938099/US/NSEC: Center for Nanotechnology in Society at University of California, Santa Barbara/
info:eu-repo/grantAgreement/NSF//0531194/US/NSEC: Center for Nanotechnology in Society at Arizona State University/
Agradecimientos:
We thank Kevin Boyack, Loet Leydesdorff, and Antoine Schoen for open and fruitful discussions about this paper. This research was undertaken largely at Georgia Tech drawing on support from the U.S. National Science Foundation ...[+]
Tipo: Artículo

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