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Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials

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Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials

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Roa, JJ.; Rayón Encinas, E.; Morales, M.; Segarra, M. (2012). Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials. Recent Patents on Engineering. 6(2):142-152. doi:10.2174/187221212801227130

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/51952

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Title: Contact mechanics at nanometric scale using nanoindentation technique for brittle and ductile materials
Author: Roa, J. J. Rayón Encinas, Emilio Morales, M. Segarra, M.
UPV Unit: Universitat Politècnica de València. Instituto de Tecnología de Materiales - Institut de Tecnologia de Materials
Universitat Politècnica de València. Departamento de Ingeniería Mecánica y de Materiales - Departament d'Enginyeria Mecànica i de Materials
Issued date:
Abstract:
In the last years, Nanoindentation or Instrumented Indentation Technique has become a powerful tool to study the mechanical properties at micro/nanometric scale (commonly known as hardness, elastic modulus and the stress-strain ...[+]
Subjects: Brittle materials , Contact mechanisms , Ductile materials , Mechanical properties , Nanoindentation technique
Copyrigths: Cerrado
Source:
Recent Patents on Engineering. (issn: 1872-2121 )
DOI: 10.2174/187221212801227130
Publisher:
Bentham Science Publishers
Publisher version: http://dx.doi.org/10.2174/187221212801227130
Type: Artículo

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