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A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits

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A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits

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Nombre: Soto;D. Dascalu;D. ...
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dc.contributor.author Muller, Andrei A. es_ES
dc.contributor.author Soto Pacheco, Pablo es_ES
dc.contributor.author Dascalu, Dan es_ES
dc.contributor.author Neculoiu, Dan es_ES
dc.contributor.author Boria Esbert, Vicente Enrique es_ES
dc.date.accessioned 2015-09-25T10:31:10Z
dc.date.available 2015-09-25T10:31:10Z
dc.date.issued 2011-06
dc.identifier.issn 1531-1309
dc.identifier.uri http://hdl.handle.net/10251/55107
dc.description “© © 20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.” es_ES
dc.description.abstract This letter proposes a spherical 3-D Smith Chart suitable for representing both active and passive microwave circuits. Using the mathematical concept of the Riemann sphere, the extended reflection coefficient plane is transformed into the surface of the unit sphere. Since the proposed Smith Chart compiles the whole complex plane, all possible loads are included. A simple graphic tool is thus obtained that successfully unifies active and passive circuits. In addition, lossy lines with complex characteristic impedances can also be represented. The letter presents the 3-D Smith Chart, provides its main governing equations, and also enumerates its more important properties. © 2011 IEEE. es_ES
dc.description.sponsorship This work was supported in part by the POSDRU ID 7713 European Project and by the Ministerio de Ciencia e Innovacion, Spanish Government under Research Project TEC2010-21520-C04-01. en_EN
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) es_ES
dc.relation.ispartof IEEE Microwave and Wireless Components Letters es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Active circuits es_ES
dc.subject Immittance es_ES
dc.subject Lossy circuits es_ES
dc.subject Reflection coefficient es_ES
dc.subject Smith Chart es_ES
dc.subject Transmission lines es_ES
dc.subject Microwave circuits es_ES
dc.subject Microwave devices es_ES
dc.subject Reflection es_ES
dc.subject Spheres es_ES
dc.subject Three dimensional es_ES
dc.subject Passive networks es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.title A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/LMWC.2011.2132697
dc.relation.projectID info:eu-repo/grantAgreement/ESF//POSDRU%2F7713/ es_ES
dc.relation.projectID info:eu-repo/grantAgreement/MICINN//TEC2010-21520-C04-01/ES/DESARROLLO TECNOLOGICO AVANZADO DE DISPOSITIVOS PASIVOS EN TECNOLOGIA GUIADA PARA CARGAS UTILES DE SATELITES/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Telecomunicación y Aplicaciones Multimedia - Institut Universitari de Telecomunicacions i Aplicacions Multimèdia es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.description.bibliographicCitation Muller, AA.; Soto Pacheco, P.; Dascalu, D.; Neculoiu, D.; Boria Esbert, VE. (2011). A 3D Smith Chart based on the Riemann Sphere for Active and Passive Microwave Circuits. IEEE Microwave and Wireless Components Letters. 21(6):286-288. https://doi.org/10.1109/LMWC.2011.2132697 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://dx.doi.org/10.1109/LMWC.2011.2132697 es_ES
dc.description.upvformatpinicio 286 es_ES
dc.description.upvformatpfin 288 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 21 es_ES
dc.description.issue 6 es_ES
dc.relation.senia 41337 es_ES
dc.contributor.funder Ministerio de Ciencia e Innovación es_ES
dc.contributor.funder European Social Fund es_ES


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