- -

Microwave sensor system for continuous monitoring of adhesive curing processes

RiuNet: Institutional repository of the Polithecnic University of Valencia

Share/Send to

Cited by

Statistics

Microwave sensor system for continuous monitoring of adhesive curing processes

Show full item record

García Baños, B.; Catalá Civera, JM.; Penaranda-Foix, FL.; Canós Marín, AJ.; Sahuquillo Navarro, O. (2012). Microwave sensor system for continuous monitoring of adhesive curing processes. Measurement Science and Technology. 23(3). https://doi.org/10.1088/0957-0233/23/3/035101

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/57299

Files in this item

Item Metadata

Title: Microwave sensor system for continuous monitoring of adhesive curing processes
Author: García Baños, Beatriz Catalá Civera, José Manuel Penaranda-Foix, Felipe L. Canós Marín, Antoni Josep Sahuquillo Navarro, Oscar
UPV Unit: Universitat Politècnica de València. Instituto Universitario de Aplicaciones de las Tecnologías de la Información - Institut Universitari d'Aplicacions de les Tecnologies de la Informació
Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
Universitat Politècnica de València. Departamento de Ingeniería Mecánica y de Materiales - Departament d'Enginyeria Mecànica i de Materials
Issued date:
Abstract:
A microwave sensor system has been developed for monitoring adhesive curing processes. The system provides continuous, real-time information about the curing progress without interfering with the reaction. An open-coaxial ...[+]
Subjects: Adhesives , Cure process , Microwave sensor , Monitoring , Open-ended coaxial resonator , Polymers , Adhesive curing process , Coaxial resonators , Continuous monitoring , Conventional measurements , Cure time , Quality factors , Reaction progress , Real-time information , Resonance frequencies , Sensor head , Dielectric properties , Differential scanning calorimetry , Electric impedance measurement , Microwave sensors , Reaction rates , Curing
Copyrigths: Reserva de todos los derechos
Source:
Measurement Science and Technology. (issn: 0957-0233 ) (eissn: 1361-6501 )
DOI: 10.1088/0957-0233/23/3/035101
Publisher:
IOP Publishing: Hybrid Open Access
Publisher version: http://dx.doi.org/10.1088/0957-0233/23/3/035101
Project ID:
info:eu-repo/grantAgreement/MICINN//TEC2008-04109/ES/MONITORIZACION IN SITU DE NANOPOLVOS Y PROCESOS POR DIELECTROMETRIA DE MICROONDAS/
Thanks:
The authors thank Rut Benavente Martinez for her assistance in the DSC experiments. The contract of BG-B is financed by the Ministry of Science and Innovation of Spain, through the 'Torres Quevedo' Sub-programme, which is ...[+]
Type: Artículo

References

Jost, M., & Sernek, M. (2008). Shear strength development of the phenol–formaldehyde adhesive bond during cure. Wood Science and Technology, 43(1-2), 153-166. doi:10.1007/s00226-008-0217-2

Costa, M. L., Botelho, E. C., Paiva, J. M. F. de, & Rezende, M. C. (2005). Characterization of cure of carbon/epoxy prepreg used in aerospace field. Materials Research, 8(3), 317-322. doi:10.1590/s1516-14392005000300016

Chen, J., & Hojjati, M. (2007). Microdielectric analysis and curing kinetics of an epoxy resin system. Polymer Engineering & Science, 47(2), 150-158. doi:10.1002/pen.20687 [+]
Jost, M., & Sernek, M. (2008). Shear strength development of the phenol–formaldehyde adhesive bond during cure. Wood Science and Technology, 43(1-2), 153-166. doi:10.1007/s00226-008-0217-2

Costa, M. L., Botelho, E. C., Paiva, J. M. F. de, & Rezende, M. C. (2005). Characterization of cure of carbon/epoxy prepreg used in aerospace field. Materials Research, 8(3), 317-322. doi:10.1590/s1516-14392005000300016

Chen, J., & Hojjati, M. (2007). Microdielectric analysis and curing kinetics of an epoxy resin system. Polymer Engineering & Science, 47(2), 150-158. doi:10.1002/pen.20687

Sernek, M., & Kamke, F. A. (2007). Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive. International Journal of Adhesion and Adhesives, 27(7), 562-567. doi:10.1016/j.ijadhadh.2006.10.004

Núñez, L., Gómez-Barreiro, S., Gracia-Fernández, C. A., & Núñez, M. R. (2004). Use of the dielectric analysis to complement previous thermoanalytical studies on the system diglycidyl ether of bisphenol A/1,2 diamine cyclohexane. Polymer, 45(4), 1167-1175. doi:10.1016/j.polymer.2003.12.024

Lefebvre, D. R., Han, J., Lipari, J. M., Long, M. A., McSwain, R. L., & Wells, H. C. (2006). Dielectric analysis for in-situ monitoring of gelatin renaturation and crosslinking. Journal of Applied Polymer Science, 101(5), 2765-2775. doi:10.1002/app.21631

Cordovez, M., Li, Y., & Karbhari, V. M. (2004). Assessment of Dielectrometry for Characterization of Processing and Moisture Absorption in FRP Composites. Journal of Reinforced Plastics and Composites, 23(4), 445-456. doi:10.1177/0731684404031980

Das, N. K., Voda, S. M., & Pozar, D. M. (1987). Two Methods for the Measurement of Substrate Dielectric Constant. IEEE Transactions on Microwave Theory and Techniques, 35(7), 636-642. doi:10.1109/tmtt.1987.1133722

Fioretto, D., Livi, A., Rolla, P. A., Socino, G., & Verdini, L. (1994). The dynamics of poly(n-butyl acrylate) above the glass transition. Journal of Physics: Condensed Matter, 6(28), 5295-5302. doi:10.1088/0953-8984/6/28/007

Givot, B. L., Krupka, J., & Belete, D. Y. (s. f.). Split post dielectric resonator technique for dielectric cure monitoring of structural adhesives. 13th International Conference on Microwaves, Radar and Wireless Communications. MIKON - 2000. Conference Proceedings (IEEE Cat. No.00EX428). doi:10.1109/mikon.2000.913931

Canos, A. J., Catala-Civera, J. M., Penaranda-Foix, F. L., & Reyes-Davo, E. (2006). A novel technique for deembedding the unloaded resonance frequency from measurements of microwave cavities. IEEE Transactions on Microwave Theory and Techniques, 54(8), 3407-3416. doi:10.1109/tmtt.2006.877833

Marks, R. B., & Williams, D. F. (1992). A general waveguide circuit theory. Journal of Research of the National Institute of Standards and Technology, 97(5), 533. doi:10.6028/jres.097.024

Harrington, R. F. (1967). Matrix methods for field problems. Proceedings of the IEEE, 55(2), 136-149. doi:10.1109/proc.1967.5433

Baker-Jarvis, J., Janezic, M. D., Domich, P. D., & Geyer, R. G. (1994). Analysis of an open-ended coaxial probe with lift-off for nondestructive testing. IEEE Transactions on Instrumentation and Measurement, 43(5), 711-718. doi:10.1109/19.328897

Taylor, B. N. (1994). Guidelines for evaluating and expressing the uncertainty of NIST measurement results. doi:10.6028/nist.tn.1297

Casalini, R., Corezzi, S., Livi, A., Levita, G., & Rolla, P. A. (1997). Dielectric parameters to monitor the crosslink of epoxy resins. Journal of Applied Polymer Science, 65(1), 17-25. doi:10.1002/(sici)1097-4628(19970705)65:1<17::aid-app3>3.0.co;2-t

Preu, H., & Mengel, M. (2007). Experimental and theoretical study of a fast curing adhesive. International Journal of Adhesion and Adhesives, 27(4), 330-337. doi:10.1016/j.ijadhadh.2006.06.004

Harper, D. P., Wolcott, M. P., & Rials, T. G. (2001). Evaluation of the cure kinetics of the wood/pMDI bondline. International Journal of Adhesion and Adhesives, 21(2), 137-144. doi:10.1016/s0143-7496(00)00045-2

Garcia-Banos, B., Canos, A. J., Penaranda-Foix, F. L., & Catala-Civera, J. M. (2011). Noninvasive Monitoring of Polymer Curing Reactions by Dielectrometry. IEEE Sensors Journal, 11(1), 62-70. doi:10.1109/jsen.2010.2050475

He, Y. (2001). DSC and DEA studies of underfill curing kinetics. Thermochimica Acta, 367-368, 101-106. doi:10.1016/s0040-6031(00)00654-7

Núñez-Regueira, L., Gracia-Fernández, C. A., & Gómez-Barreiro, S. (2005). Use of rheology, dielectric analysis and differential scanning calorimetry for gel time determination of a thermoset. Polymer, 46(16), 5979-5985. doi:10.1016/j.polymer.2005.05.060

[-]

recommendations

 

This item appears in the following Collection(s)

Show full item record