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Microwave sensor system for continuous monitoring of adhesive curing processes

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Microwave sensor system for continuous monitoring of adhesive curing processes

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dc.contributor.author García Baños, Beatriz es_ES
dc.contributor.author Catalá Civera, José Manuel es_ES
dc.contributor.author Penaranda-Foix, Felipe L. es_ES
dc.contributor.author Canós Marín, Antoni Josep es_ES
dc.contributor.author Sahuquillo Navarro, Oscar es_ES
dc.date.accessioned 2015-11-10T13:49:15Z
dc.date.available 2015-11-10T13:49:15Z
dc.date.issued 2012-03
dc.identifier.issn 0957-0233
dc.identifier.uri http://hdl.handle.net/10251/57299
dc.description.abstract A microwave sensor system has been developed for monitoring adhesive curing processes. The system provides continuous, real-time information about the curing progress without interfering with the reaction. An open-coaxial resonator is used as the sensor head, and measurements of its resonance frequency and quality factor are performed during cure to follow the reaction progress. Additionally, the system provides other interesting parameters such as reaction rate or cure time. The adhesive dielectric properties can also be computed off-line, which gives additional information about the process. The results given by the system correlate very well with conventional measurement techniques such as differential scanning calorimetry, combining accuracy and rate with simplicity and an affordable cost. © 2012 IOP Publishing Ltd. es_ES
dc.description.sponsorship The authors thank Rut Benavente Martinez for her assistance in the DSC experiments. The contract of BG-B is financed by the Ministry of Science and Innovation of Spain, through the 'Torres Quevedo' Sub-programme, which is also co-financed by the European Social Fund (ESF). This work has been financed by the Ministry of Science and Innovation of Spain through the project MONIDIEL (TEC2008-04109). en_EN
dc.language Inglés es_ES
dc.publisher IOP Publishing: Hybrid Open Access es_ES
dc.relation.ispartof Measurement Science and Technology es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Adhesives es_ES
dc.subject Cure process es_ES
dc.subject Microwave sensor es_ES
dc.subject Monitoring es_ES
dc.subject Open-ended coaxial resonator es_ES
dc.subject Polymers es_ES
dc.subject Adhesive curing process es_ES
dc.subject Coaxial resonators es_ES
dc.subject Continuous monitoring es_ES
dc.subject Conventional measurements es_ES
dc.subject Cure time es_ES
dc.subject Quality factors es_ES
dc.subject Reaction progress es_ES
dc.subject Real-time information es_ES
dc.subject Resonance frequencies es_ES
dc.subject Sensor head es_ES
dc.subject Dielectric properties es_ES
dc.subject Differential scanning calorimetry es_ES
dc.subject Electric impedance measurement es_ES
dc.subject Microwave sensors es_ES
dc.subject Reaction rates es_ES
dc.subject Curing es_ES
dc.subject.classification TEORIA DE LA SEÑAL Y COMUNICACIONES es_ES
dc.subject.classification CIENCIA DE LOS MATERIALES E INGENIERIA METALURGICA es_ES
dc.title Microwave sensor system for continuous monitoring of adhesive curing processes es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1088/0957-0233/23/3/035101
dc.relation.projectID info:eu-repo/grantAgreement/MICINN//TEC2008-04109/ES/MONITORIZACION IN SITU DE NANOPOLVOS Y PROCESOS POR DIELECTROMETRIA DE MICROONDAS/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Aplicaciones de las Tecnologías de la Información - Institut Universitari d'Aplicacions de les Tecnologies de la Informació es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions es_ES
dc.contributor.affiliation Universitat Politècnica de València. Departamento de Ingeniería Mecánica y de Materiales - Departament d'Enginyeria Mecànica i de Materials es_ES
dc.description.bibliographicCitation García Baños, B.; Catalá Civera, JM.; Penaranda-Foix, FL.; Canós Marín, AJ.; Sahuquillo Navarro, O. (2012). Microwave sensor system for continuous monitoring of adhesive curing processes. Measurement Science and Technology. 23(3). https://doi.org/10.1088/0957-0233/23/3/035101 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://dx.doi.org/10.1088/0957-0233/23/3/035101 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 23 es_ES
dc.description.issue 3 es_ES
dc.relation.senia 207747 es_ES
dc.identifier.eissn 1361-6501
dc.contributor.funder Ministerio de Ciencia e Innovación es_ES
dc.contributor.funder European Social Fund es_ES
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