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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Zimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. doi:10.1109/JSTQE.2010.2084992

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Título: Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform
Autor:
Entidad UPV: Universitat Politècnica de València. Instituto Universitario de Tecnología Nanofotónica - Institut Universitari de Tecnologia Nanofotònica
Fecha difusión:
Resumen:
[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples ...[+]
Palabras clave: Hybrid integrated-circuit packaging , Photonic integration , Silicon-on-insulator (SOI)
Derechos de uso: Reserva de todos los derechos
Fuente:
IEEE Journal of Selected Topics in Quantum Electronics. (issn: 1077-260X )
DOI: 10.1109/JSTQE.2010.2084992
Editorial:
Institute of Electrical and Electronics Engineers (IEEE)
Versión del editor: http://dx.doi.org/10.1109/JSTQE.2010.2084992
Código del Proyecto: info:eu-repo/grantAgreement/EC/FP7/224375
Agradecimientos:
This work was supported in part by the European Union (EU)-funded FP6-project ePIXnet, and in part by the FP7-project BOOM.
Tipo: Artículo

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