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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Zimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. doi:10.1109/JSTQE.2010.2084992

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/67695

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Title: Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform
Author:
UPV Unit: Universitat Politècnica de València. Instituto Universitario de Tecnología Nanofotónica - Institut Universitari de Tecnologia Nanofotònica
Issued date:
Abstract:
[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples ...[+]
Subjects: Hybrid integrated-circuit packaging , Photonic integration , Silicon-on-insulator (SOI)
Copyrigths: Reserva de todos los derechos
Source:
IEEE Journal of Selected Topics in Quantum Electronics. (issn: 1077-260X )
DOI: 10.1109/JSTQE.2010.2084992
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publisher version: http://dx.doi.org/10.1109/JSTQE.2010.2084992
Project ID: info:eu-repo/grantAgreement/EC/FP7/224375
Thanks:
This work was supported in part by the European Union (EU)-funded FP6-project ePIXnet, and in part by the FP7-project BOOM.
Type: Artículo

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