Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform
Fecha
Directores
Editores
Otras autorías
Unidades organizativas
Handle
https://riunet.upv.es/handle/10251/67695
Cita bibliográfica
Zimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. https://doi.org/10.1109/JSTQE.2010.2084992
Titulación
Resumen
[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices
Fuente
IEEE Journal of Selected Topics in Quantum Electronics issn: 1077-260X