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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

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Nombre: IEEE-JSTQE2084992.pdf
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Nombre: gpreve_quantum.pdf
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dc.contributor.author Zimmermann, Lars es_ES
dc.contributor.author Preve, Giovan Battista es_ES
dc.contributor.author Tekin, Tolga es_ES
dc.contributor.author Rosin, T. es_ES
dc.contributor.author Landles, K. es_ES
dc.date.accessioned 2016-07-18T08:26:00Z
dc.date.available 2016-07-18T08:26:00Z
dc.date.issued 2011-05
dc.identifier.issn 1077-260X
dc.identifier.uri http://hdl.handle.net/10251/67695
dc.description.abstract [EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices es_ES
dc.description.sponsorship This work was supported in part by the European Union (EU)-funded FP6-project ePIXnet, and in part by the FP7-project BOOM.
dc.language Inglés es_ES
dc.publisher Institute of Electrical and Electronics Engineers (IEEE) es_ES
dc.relation.ispartof IEEE Journal of Selected Topics in Quantum Electronics es_ES
dc.rights Reserva de todos los derechos es_ES
dc.subject Hybrid integrated-circuit packaging es_ES
dc.subject Photonic integration es_ES
dc.subject Silicon-on-insulator (SOI) es_ES
dc.title Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform es_ES
dc.type Artículo es_ES
dc.identifier.doi 10.1109/JSTQE.2010.2084992
dc.relation.projectID info:eu-repo/grantAgreement/EC/FP7/224375/EU/Terabit-on-chip: micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers/
dc.relation.projectID info:eu-repo/grantAgreement/EC/FP6/004525/EU/European Network of Excellence on Photonic Integrated Components and Circuits/ePIXnet/ es_ES
dc.rights.accessRights Abierto es_ES
dc.contributor.affiliation Universitat Politècnica de València. Instituto Universitario de Tecnología Nanofotónica - Institut Universitari de Tecnologia Nanofotònica es_ES
dc.description.bibliographicCitation Zimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. https://doi.org/10.1109/JSTQE.2010.2084992 es_ES
dc.description.accrualMethod S es_ES
dc.relation.publisherversion http://dx.doi.org/10.1109/JSTQE.2010.2084992 es_ES
dc.description.upvformatpinicio 645 es_ES
dc.description.upvformatpfin 651 es_ES
dc.type.version info:eu-repo/semantics/publishedVersion es_ES
dc.description.volume 17 es_ES
dc.description.issue 3 es_ES
dc.relation.senia 222255 es_ES
dc.contributor.funder European Commission


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