Belenguer Martínez, Á.; Fernández-Berlanga, MD.; Ballesteros, JA.; De Dios, JJ.; Esteban González, H.; Boria Esbert, VE. (2018). Compact Multilayer Filter in Empty Substrate Integrated Waveguide With Transmission Zeros. IEEE Transactions on Microwave Theory and Techniques. 66(6):2993-3000. https://doi.org/10.1109/TMTT.2018.2823306
Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10251/121368
Title:
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Compact Multilayer Filter in Empty Substrate Integrated Waveguide With Transmission Zeros
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Author:
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Belenguer Martínez, Ángel
Fernández-Berlanga, Marcos D
Ballesteros, José A.
de Dios, Juan J.
Esteban González, Héctor
Boria Esbert, Vicente Enrique
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UPV Unit:
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Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions
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Issued date:
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Abstract:
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[EN] The empty substrate integrated waveguide (ESIW) technology is recently receiving special attention, since it preserves the many advantages of SIW circuits but provides an enhanced behavior due to avoidance of dielectric ...[+]
[EN] The empty substrate integrated waveguide (ESIW) technology is recently receiving special attention, since it preserves the many advantages of SIW circuits but provides an enhanced behavior due to avoidance of dielectric filling. Many circuits have been designed in the ESIW technology, including several filters with different performances. The next challenge is to achieve the maximum possible compactness degree for these circuits. In this paper, we present the design of a multilayer empty substrate integrated filter with the same performance as if it were manufactured in a single layer but significantly increasing its compactness and mechanical resistance.
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Subjects:
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Compact bandpass filter
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Empty substrate integrated waveguide (ESIW)
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High quality factor
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Multi- layer
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Substrate integrated circuit (SIC)
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Substrate integrated waveguide (SIW)
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Copyrigths:
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Reserva de todos los derechos
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Source:
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IEEE Transactions on Microwave Theory and Techniques. (issn:
0018-9480
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DOI:
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10.1109/TMTT.2018.2823306
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Publisher:
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Institute of Electrical and Electronics Engineers
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Publisher version:
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http://doi.org/10.1109/TMTT.2018.2823306
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Project ID:
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AEI/TEC2016-75934-C4-1-R
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Description:
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© 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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Thanks:
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This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Grant TEC2016-75934-C4-3-R and Grant TEC2016-75934-C4-1-R.
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Type:
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Artículo
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