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dc.contributor.author | Belenguer Martínez, Ángel | es_ES |
dc.contributor.author | Fernández-Berlanga, Marcos D | es_ES |
dc.contributor.author | Ballesteros, José A. | es_ES |
dc.contributor.author | de Dios, Juan J. | es_ES |
dc.contributor.author | Esteban González, Héctor | es_ES |
dc.contributor.author | Boria Esbert, Vicente Enrique | es_ES |
dc.date.accessioned | 2019-05-31T20:43:36Z | |
dc.date.available | 2019-05-31T20:43:36Z | |
dc.date.issued | 2018 | es_ES |
dc.identifier.issn | 0018-9480 | es_ES |
dc.identifier.uri | http://hdl.handle.net/10251/121368 | |
dc.description | © 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |
dc.description.abstract | [EN] The empty substrate integrated waveguide (ESIW) technology is recently receiving special attention, since it preserves the many advantages of SIW circuits but provides an enhanced behavior due to avoidance of dielectric filling. Many circuits have been designed in the ESIW technology, including several filters with different performances. The next challenge is to achieve the maximum possible compactness degree for these circuits. In this paper, we present the design of a multilayer empty substrate integrated filter with the same performance as if it were manufactured in a single layer but significantly increasing its compactness and mechanical resistance. | es_ES |
dc.description.sponsorship | This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Grant TEC2016-75934-C4-3-R and Grant TEC2016-75934-C4-1-R. | es_ES |
dc.language | Inglés | es_ES |
dc.publisher | Institute of Electrical and Electronics Engineers | es_ES |
dc.relation.ispartof | IEEE Transactions on Microwave Theory and Techniques | es_ES |
dc.rights | Reserva de todos los derechos | es_ES |
dc.subject | Compact bandpass filter | es_ES |
dc.subject | Empty substrate integrated waveguide (ESIW) | es_ES |
dc.subject | High quality factor | es_ES |
dc.subject | Multi- layer | es_ES |
dc.subject | Substrate integrated circuit (SIC) | es_ES |
dc.subject | Substrate integrated waveguide (SIW) | es_ES |
dc.subject.classification | TEORIA DE LA SEÑAL Y COMUNICACIONES | es_ES |
dc.title | Compact Multilayer Filter in Empty Substrate Integrated Waveguide With Transmission Zeros | es_ES |
dc.type | Artículo | es_ES |
dc.identifier.doi | 10.1109/TMTT.2018.2823306 | es_ES |
dc.relation.projectID | info:eu-repo/grantAgreement/MINECO//TEC2016-75934-C4-1-R/ES/DEMOSTRADORES TECNOLOGICOS DE FILTROS Y MULTIPLEXORES CON RESPUESTAS SELECTIVAS Y SINTONIZABLES EN NUEVAS GUIAS COMPACTAS PARA APLICACIONES ESPACIALES/ | es_ES |
dc.rights.accessRights | Abierto | es_ES |
dc.contributor.affiliation | Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions | es_ES |
dc.description.bibliographicCitation | Belenguer Martínez, Á.; Fernández-Berlanga, MD.; Ballesteros, JA.; De Dios, JJ.; Esteban González, H.; Boria Esbert, VE. (2018). Compact Multilayer Filter in Empty Substrate Integrated Waveguide With Transmission Zeros. IEEE Transactions on Microwave Theory and Techniques. 66(6):2993-3000. https://doi.org/10.1109/TMTT.2018.2823306 | es_ES |
dc.description.accrualMethod | S | es_ES |
dc.relation.publisherversion | http://doi.org/10.1109/TMTT.2018.2823306 | es_ES |
dc.description.upvformatpinicio | 2993 | es_ES |
dc.description.upvformatpfin | 3000 | es_ES |
dc.type.version | info:eu-repo/semantics/publishedVersion | es_ES |
dc.description.volume | 66 | es_ES |
dc.description.issue | 6 | es_ES |
dc.relation.pasarela | S\362725 | es_ES |
dc.contributor.funder | Ministerio de Economía y Competitividad | es_ES |